HCPL-7720-000E Avago Technologies US Inc., HCPL-7720-000E Datasheet - Page 5

OPTOCOUPLER CMOS 25MBD 8-DIP

HCPL-7720-000E

Manufacturer Part Number
HCPL-7720-000E
Description
OPTOCOUPLER CMOS 25MBD 8-DIP
Manufacturer
Avago Technologies US Inc.
Datasheet

Specifications of HCPL-7720-000E

Package / Case
8-DIP (0.300", 7.62mm)
Voltage - Isolation
3750Vrms
Number Of Channels
1, Unidirectional
Current - Output / Channel
10mA
Data Rate
25MBd
Propagation Delay High - Low @ If
20ns
Input Type
Logic
Output Type
Push-Pull, Totem-Pole
Mounting Type
Through Hole
Isolation Voltage
3750 Vrms
Maximum Continuous Output Current
10 mA
Maximum Fall Time
0.008 us
Maximum Forward Diode Current
10 mA
Output Device
Logic Gate Photo IC
Configuration
1 Channel
Maximum Baud Rate
25 MBd
Maximum Power Dissipation
150 mW
Maximum Operating Temperature
+ 85 C
Minimum Operating Temperature
- 40 C
No. Of Channels
1
Optocoupler Output Type
Gate Drive
Input Current
10µA
Output Voltage
5V
Opto Case Style
DIP
No. Of Pins
8
Common Mode Ratio
10000
Rohs Compliant
Yes
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant
Other names
516-1689-5

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
HCPL-7720-000E
Manufacturer:
AVAGO
Quantity:
5 000
Part Number:
HCPL-7720-000E
Manufacturer:
AVAGO/安华高
Quantity:
20 000
Solder Reflow Thermal Profile
Pb-Free IR Profile
Regulatory Information
The HCPL-772X/072X have been approved by the following organizations:
UL
Recognized under UL 1577, component recognition program, File E55361.
CSA
Approved under CSA Component Acceptance Notice #5, File CA88324.
IEC/EN/DIN EN 60747-5-2
Approved under:
IEC 60747-5-2:1997 + A1:2002
EN 60747-5-2:2001 + A1:2002
DIN EN 60747-5-2 (VDE 0884Teil 2):2003-01. (Option 060 only)
5
TEMPERATURE
ROOM
NOTES:
THE TIME FROM 25 °C to PEAK TEMPERATURE = 8 MINUTES MAX.
T
Note: Non-halide flux should be used.
Note: Non-halide flux should be used.
T
T
smax
smax
smin
300
200
100
T
T
25
p
L
0
= 200 °C, T
0
150 - 200 °C
217 °C
PREHEATING RATE 3°C + 1°C/–0.5°C/SEC.
REFLOW HEATING RATE 2.5°C ± 0.5°C/SEC.
160°C
150°C
140°C
t 25 °C to PEAK
3 °C/SEC. MAX.
60 to 180 SEC.
smin
PREHEAT
RAMP-UP
= 150 °C
t
50
s
260 +0/-5 °C
3°C + 1°C/–0.5°C
150°C, 90 + 30 SEC.
PREHEATING TIME
TIME
2.5°C ± 0.5°C/SEC.
100
t
TIME (SECONDS)
t
L
p
TIME WITHIN 5 °C of ACTUAL
PEAK TEMPERATURE
20-40 SEC.
60 to 150 SEC.
TEMP.
PEAK
245°C
RAMP-DOWN
6 °C/SEC. MAX.
150
SEC.
SEC.
30
30
50 SEC.
SOLDERING
200°C
TIME
200
PEAK
TEMP.
240°C
TIGHT
TYPICAL
LOOSE
TEMP.
PEAK
230°C
250

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