MAX9257AGCM+ Maxim Integrated, MAX9257AGCM+ Datasheet - Page 2

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MAX9257AGCM+

Manufacturer Part Number
MAX9257AGCM+
Description
Serializers & Deserializers - Serdes Prog Serializer / Deserializer
Manufacturer
Maxim Integrated
Type
Serializerr
Datasheet

Specifications of MAX9257AGCM+

Rohs
yes
Data Rate
840 Mbit/s
Input Type
LVCMOS
Output Type
LVDS
Number Of Inputs
18
Number Of Outputs
1
Operating Supply Voltage
1.7 V to 3.6 V
Operating Temperature Range
- 40 C to + 105 C
Package / Case
LQFP-48
Maximum Operating Temperature
+ 105 C
Minimum Operating Temperature
- 40 C
Mounting Style
SMD/SMT
Supply Voltage - Max
3.6 V
Supply Voltage - Min
1.71 V, 3 V
ABSOLUTE MAXIMUM RATINGS
V
Any Ground to Any Ground .................................-0.5V to +0.5V
SDI+, SDI-, SDO+, SDO- to GND ........................-0.5V to +4.0V
SDO+, SDO- Short Circuit to GND or V
DIN[0:15], GPIO[0:9], PCLK_IN, HSYNC_IN, VSYNC_IN,
DOUT[0:15], PCLK_OUT, CCEN, HSYNC_OUT,
Continuous Power Dissipation (TA = +70NC)
40-Lead TQFN
48-Lead LQFP
ESD Protection
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional opera-
tion of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
PACKAGE THERMAL CHARACTERISTICS (Note 1)
Junction-to-Ambient Thermal Resistance (q
Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-
MAX9257A DC ELECTRICAL CHARACTERISTICS
(V
at V
SINGLE-ENDED INPUTS
High-Level Input Voltage
Low-Level Input Voltage
CC_
CC_
SCL/TX, SDA/RX, REM to GND ......... -0.5V to (V
VSYNC_OUT, RX, LOCK, TX, PD,
ERROR to GND .............................. -0.5V to (V
Multilayer PCB (derate 35.7mW/NC above +70NC) ...2857mW
Multilayer PCB (derate 21.7mW/NC above +70NC) ...1739mW
Human Body Model (RD = 1.5kI, CS = 100pF)
40-Pin TQFN ................................................................28NC/W
48-Pin LQFP ................................................................46NC/W
CC_
All Pins to GND ............................................................Q3kV
to GND ........................................................-0.5V to +4.0V
= +3.0V to +3.6V, V
= +3.3V, T
layer board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial.
PARAMETER
A
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= +25NC.) (Notes 2, 3)
Fully Programmable Serializer/Deserializer
CCIO
= +1.71V to +3.6V, R
SYMBOL
CCLVDS
V
V
IH
IL
JA
)
.......Continuous
CCOUT
V
V
REM input
V
V
REM input
CCIO
CCIO
CCIO
CCIO
CCIO
with UART/I
L
= 50I Q1%, T
+ 0.5V)
+ 0.5V)
= +1.71V to +3V
= +3V to +3.6V
= +1.71V to +3V
= +3V to +3.6V
CONDITIONS
A
IEC 61000-4-2 (RD = 330I, CS = 150pF)
ISO 10605 (RD = 2kI, CS = 330pF)
Storage Temperature Range ............................ -65NC to +150NC
Junction Temperature .....................................................+150NC
Lead Temperature (soldering, 10s) ................................+300NC
Soldering Temperature (reflow) ......................................+260NC
Junction-to-Case Thermal Resistance (q
= -40NC to +105NC, unless otherwise noted. Typical values are
Contact Discharge
Air Discharge
Contact Discharge
Air Discharge
Machine Model (RD = 0I, CS = 200pF)
40-Pin TQFN ...............................................................1.7NC/W
48-Pin LQFP ................................................................10NC/W
(SDI+, SDI-, SDO+, SDO-) to GND ..............................Q8kV
(SDI+, SDI-, SDO+, SDO-) to GND ............................Q20kV
(SDI+, SDI-, SDO+, SDO-) to GND ............................Q10kV
(SDI+, SDI-, SDO+, SDO-) to GND ............................Q30kV
All Pins to GND ......................................................... Q200V
MAX9257A/MAX9258A
2
C Control Channel
0.65 x
V
MIN
CCIO
2
2
0
0
0
TYP
JC
)
V
V
CCIO
CCIO
V
V
MAX
0.3
0.3
0.3 x
CC
CCIO
0.3
0.8
0.8
+
+
+
UNITS
V
V

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