PCF2129AT NXP [NXP Semiconductors], PCF2129AT Datasheet - Page 51
PCF2129AT
Manufacturer Part Number
PCF2129AT
Description
Integrated RTC, TCXO and quartz crystal
Manufacturer
NXP [NXP Semiconductors]
Datasheet
1.PCF2129AT.pdf
(68 pages)
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NXP Semiconductors
11. Limiting values
PCF2129A_1
Product data sheet
Table 51.
In accordance with the Absolute Maximum Rating System (IEC 60134).
[1]
[2]
[3]
[4]
[5]
Symbol
V
I
V
I
V
I
V
P
T
V
I
T
DD
I
O
lu
amb
stg
DD
i
O
BAT
tot
ESD
Pass level; Human Body Model (HBM) according to
Pass level; Machine Model (MM), according to
Pass level; Charged-Device Model (CDM), according to
Pass level; latch-up testing according to
According to the NXP store and transport requirements (see
stored at a temperature of +8 °C to +45 °C and a humidity of 25 % to 75 %. For long term storage products
deviant conditions are described in that document.
Limiting values
Parameter
supply voltage
supply current
input voltage
input current
output voltage
output current
battery supply voltage
total power dissipation
ambient temperature
electrostatic discharge
voltage
latch-up current
storage temperature
Rev. 01 — 13 January 2010
Ref. 10 “JESD78”
Conditions
at pin SDA
HBM
MM
CDM
Ref. 8
Integrated RTC, TCXO and quartz crystal
Ref. 7
“JESD22-A115”.
Ref. 9
“JESD22-A114”.
at maximum ambient temperature (T
Ref. 12
“JESD22-C101”.
“NX3-00092”) the devices have to be
[1]
[2]
[3]
[4]
[5]
Min
−0.5
−50
−0.5
−10
−0.5
−10
−10
−0.5
-
−40
-
-
-
-
−55
PCF2129A
© NXP B.V. 2010. All rights reserved.
Max
+4.5
+50
+6.5
+10
+6.5
+10
+20
+4.5
300
+85
±3000
±250
±1500
200
+85
amb(max)
Unit
V
mA
V
mA
V
mA
mA
V
mW
°C
V
V
V
mA
°C
51 of 68
).