ADF4106 Analog Devices, ADF4106 Datasheet - Page 4

• Manufacturer Part Number: ADF4106
• Description: PLL Frequency Synthesizer
• Manufacturer: Analog Devices

ADF4106
ABSOLUTE MAXIMUM RATINGS
(T
AV
AV
V
V
Digital I/O Voltage to GND . . . . . . . . –0.3 V to V
Analog I/O Voltage to GND . . . . . . . . . –0.3 V to V
REF
Operating Temperature Range
Storage Temperature Range . . . . . . . . . . . . –65°C to +150°C
Maximum Junction Temperature . . . . . . . . . . . . . . . . 150°C
TSSOP
CSP
Lead Temperature, Soldering
NOTES
1
2
3
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily
accumulate on the human body and test equipment and can discharge without detection. Although the
ADF4106 features proprietary ESD protection circuitry, permanent damage may occur on devices
subjected to high-energy electrostatic discharges. Therefore, proper ESD precautions are recommended
to avoid performance degradation or loss of functionality.
Stresses above those listed under Absolute Maximum Ratings may cause perma-
This device is a high-performance RF integrated circuit with an ESD rating of
GND = AGND = DGND = 0 V
nent damage to the device. This is a stress rating only; functional operation of the
device at these or any other conditions above those listed in the operational
sections of this specification is not implied. Exposure to absolute maximum rating
conditions for extended periods may affect device reliability.
<2 kV and it is ESD sensitive. Proper precautions should be taken for handling and
assembly.
P
P
A
Industrial (B Version) . . . . . . . . . . . . . . . –40°C to +85°C
Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . . . . 215°C
Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . . . . 220°C
DD
DD
to GND . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to +5.3 V
to AV
= 25°C unless otherwise noted.)
IN
JA
to GND
to DV
, RF
Thermal Impedance . . . . . . . . . . . . . . . . . . 122°C/W
DD
JA
IN
Thermal Impedance . . . . . . . . . . . . . 150.4°C/W
DD
A, RF
. . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to +5.5 V
3
. . . . . . . . . . . . . . . . . . . . . . –0.3 V to +3.6 V
. . . . . . . . . . . . . . . . . . . . . . –0.3 V to +0.3 V
IN
B to GND . . . . . . –0.3 V to V
1, 2
DD
DD
P
+ 0.3 V
+ 0.3 V
+ 0.3 V
Model
ADF4106BRU
ADF4106BCP
CP = Chip Scale Package
Contact the factory for chip availability.
Note that aluminum bond wire should not be used with the ADF4106 die.
RU = Thin Shrink Small Outline Package (TSSOP)
Temperature Range
–40°C to +85°C
–40°C to +85°C
ORDERING GUIDE
WARNING!
Package Option
RU-16
CP-20
ESD SENSITIVE DEVICE