SC16IS850LIPW,112 NXP Semiconductors, SC16IS850LIPW,112 Datasheet - Page 53

• Manufacturer Part Number: SC16IS850LIPW,112
• Manufacturer: NXP Semiconductors

Specifications of SC16IS850LIPW,112

• Lead Free Status / Rohs Status: Compliant

NXP Semiconductors
Fig 33. Package outline SOT355-1 (TSSOP24)
SC16IS850L
Product data sheet
TSSOP24: plastic thin shrink small outline package; 24 leads; body width 4.4 mm
DIMENSIONS (mm are the original dimensions)
Notes
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
2. Plastic interlead protrusions of 0.25 mm maximum per side are not included.
UNIT
mm
VERSION
OUTLINE
SOT355-1
max.
1.1
A
24
1
0.15
0.05
A
Z
1
y
pin 1 index
0.95
0.80
A
2
IEC
0.25
A
3
e
D
0.30
0.19
b
p
All information provided in this document is subject to legal disclaimers.
MO-153
JEDEC
0.2
0.1
c
REFERENCES
D
b
7.9
7.7
0
(1)
p
Rev. 1 — 22 July 2011
13
12
E
4.5
4.3
w
(2)
M
JEITA
scale
2.5
0.65
e
c
H
6.6
6.2
E
A
2
5 mm
A
L
1
1
Single UART with I
0.75
0.50
L
p
H
E
E
detail X
0.4
0.3
Q
PROJECTION
L
EUROPEAN
0.2
L
v
p
Q
SC16IS850L
0.13
w
A
(A )
2
3
C-bus/SPI interface
0.1
X
© NXP B.V. 2011. All rights reserved.
y
θ
v
A
ISSUE DATE
M
99-12-27
03-02-19
A
Z
0.5
0.2
(1)
SOT355-1
8
0
θ
o
o
53 of 60