SC16IS850LIPW,112 NXP Semiconductors, SC16IS850LIPW,112 Datasheet - Page 52

• Manufacturer Part Number: SC16IS850LIPW,112
• Manufacturer: NXP Semiconductors

Specifications of SC16IS850LIPW,112

• Lead Free Status / Rohs Status: Compliant

NXP Semiconductors
14. Package outline
Fig 32. Package outline SOT616-3 (HVQFN24)
SC16IS850L
Product data sheet
HVQFN24: plastic thermal enhanced very thin quad flat package; no leads;
24 terminals; body 4 x 4 x 0.85 mm
DIMENSIONS (mm are the original dimensions)
Note
1. Plastic or metal protrusions of 0.075 mm maximum per side are not included.
UNIT
mm
OUTLINE
VERSION
SOT616-3
max.
A
1
(1)
terminal 1
index area
terminal 1
index area
0.05
0.00
A 1
E h
L
0.30
0.18
6
1
b
- - -
IEC
0.2
c
7
24
e
D
4.1
3.9
(1)
2.75
2.45
D h
D h
e 1
0
D
All information provided in this document is subject to legal disclaimers.
MO-220
JEDEC
1/2
E
4.1
3.9
e
(1)
b
REFERENCES
19
Rev. 1 — 22 July 2011
2.75
2.45
E h
12
0.5
e
13
18
JEITA
scale
2.5
- - -
B
1/2
e
e
w
v
2.5
e 1
A
E
M
M
e 2
C
C
2.5
e 2
A
B
0.5
0.3
L
Single UART with I
5 mm
A
0.1
v
y 1 C
A 1
0.05
w
PROJECTION
EUROPEAN
0.05
y
detail X
SC16IS850L
0.1
y 1
X
2
C
C-bus/SPI interface
y
© NXP B.V. 2011. All rights reserved.
ISSUE DATE
04-11-19
05-03-10
c
SOT616-3
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