MT16HTF25664HZ-667H1 Micron Technology Inc, MT16HTF25664HZ-667H1 Datasheet - Page 11

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MT16HTF25664HZ-667H1

Manufacturer Part Number
MT16HTF25664HZ-667H1
Description
MODULE DDR2 SDRAM 2GB 200SODIMM
Manufacturer
Micron Technology Inc
Series
-r

Specifications of MT16HTF25664HZ-667H1

Memory Type
DDR2 SDRAM
Memory Size
2GB
Speed
667MT/s
Features
-
Package / Case
200-SODIMM
Main Category
DRAM Module
Sub-category
DDR2 SDRAM
Module Type
200SODIMM
Device Core Size
64b
Organization
256Mx64
Total Density
2GByte
Chip Density
128Mb
Access Time (max)
900ns
Package Type
SODIMM
Maximum Clock Rate
667MHz
Operating Supply Voltage (typ)
1.8V
Operating Current
1.136A
Number Of Elements
16
Operating Supply Voltage (max)
1.9V
Operating Supply Voltage (min)
1.7V
Operating Temp Range
0C to 70C
Operating Temperature Classification
Commercial
Pin Count
200
Mounting
Socket
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
IDD Specifications
Table 10: DDR2 I
Values shown for MT47H64M8 DDR2 SDRAM only and are computed from values specified in the 512Mb (64 Meg x 8)
component data sheet
PDF: 09005aef8339ef97
htf16c128_256_512x64hz.pdf - Rev. C 9/10 EN
Parameter
Operating one bank active-precharge current:
t
bus inputs are switching; Data bus inputs are switching
Operating one bank active-read-precharge current: I
CL (I
(I
switching; Data pattern is same as I
Precharge power-down current: All device banks idle;
LOW; Other control and address bus inputs are stable; Data bus inputs are floating
Precharge quiet standby current: All device banks idle;
HIGH, S# is HIGH; Other control and address bus inputs are stable; Data bus inputs
are floating
Precharge standby current: All device banks idle;
S# is HIGH; Other control and address bus inputs are switching; Data bus inputs
are switching
Active power-down current: All device banks open;
t
bus inputs are stable; Data bus inputs are floating
Active standby current: All device banks open;
(I
trol and address bus inputs are switching; Data bus inputs are switching
Operating burst write current: All device banks open; Continuous burst writes;
BL = 4, CL = CL (I
CKE is HIGH, S# is HIGH between valid commands; Address bus inputs are switch-
ing; Data bus inputs are switching
Operating burst read current: All device banks open; Continuous burst read,
I
=
are switching; Data bus inputs are switching
Burst refresh current:
val; CKE is HIGH, S# is HIGH between valid commands; Other control and address
bus inputs are switching; Data bus inputs are switching
Self refresh current: CK and CK# at 0V; CKE ≤ 0.2V; Other control and address
bus inputs are floating; Data bus inputs are floating
RAS =
CK =
OUT
DD
DD
t
RP (I
); CKE is HIGH, S# is HIGH between valid commands; Address bus inputs are
),
DD
= 0mA; BL = 4, CL = CL (I
t
t
RP =
CK (I
), AL = 0;
DD
t
RAS MIN (I
); CKE is HIGH, S# is HIGH between valid commands; Address bus inputs
DD
t
RP (I
); CKE is LOW; Other control and address
t
DD
DD
CK =
DD
); CKE is HIGH, S# is HIGH between valid commands; Other con-
), AL = 0;
DD
); CKE is HIGH, S# is HIGH between valid commands; Address
t
CK (I
Specifications and Conditions – 1GB
t
CK =
DD
t
DD
CK =
),
t
CK (I
), AL = 0;
t
RC =
t
CK (I
DD
DD4W
t
); REFRESH command at every
RC (I
DD
t
1GB, 2GB, 4GB (x64, DR) 200-Pin DDR2 SDRAM SODIMM
CK =
),
DD
t
RAS =
),
t
t
CK (I
RAS =
t
CK =
t
t
RAS MAX (I
CK =
DD
t
CK =
t
),
RAS MIN (I
t
t
CK (I
Fast PDN exit MR[12] = 0
Slow PDN exit MR[12] = 1
RAS =
t
CK (I
t
OUT
CK =
t
t
CK (I
CK =
11
DD
= 0mA; BL = 4, CL =
DD
DD
t
),
t
DD
RAS MAX (I
CK (I
),
t
DD
),
t
CK (I
); CKE is HIGH,
RAS =
t
RC =
t
),
RP =
t
RFC (I
DD
t
RCD =
DD
Micron Technology, Inc. reserves the right to change products or specifications without notice.
); CKE is
t
t
); CKE is
t
RC (I
RAS MAX
RP (I
DD
DD
) inter-
t
RCD
DD
),
DD
t
),
RP
);
Symbol -1GA
I
I
I
I
I
I
I
DD4W
I
I
DD2Q
DD2N
DD3N
I
I
DD2P
DD3P
DD4R
DD0
DD1
DD5
DD6
1
1
2
2
2
2
1
2
2
2
1
© 2008 Micron Technology, Inc. All rights reserved.
IDD Specifications
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
-80E/
1120 1040
1616 1416
1696 1496
3680 2880
-800
856
979
112
800
880
640
192
112
-667 Units
776
896
112
720
800
560
192
112
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA

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