MT16HTF25664HZ-667H1 Micron Technology Inc, MT16HTF25664HZ-667H1 Datasheet - Page 7

• Manufacturer Part Number: MT16HTF25664HZ-667H1
• Description: MODULE DDR2 SDRAM 2GB 200SODIMM
• Manufacturer: Micron Technology Inc
• Series: -r

Specifications of MT16HTF25664HZ-667H1

• Memory Type: DDR2 SDRAM
• Memory Size: 2GB
• Speed: 667MT/s
• Features: -
• Package / Case: 200-SODIMM
• Main Category: DRAM Module
• Sub-category: DDR2 SDRAM
• Module Type: 200SODIMM
• Device Core Size: 64b
• Organization: 256Mx64
• Total Density: 2GByte
• Chip Density: 128Mb
• Access Time (max): 900ns
• Package Type: SODIMM
• Maximum Clock Rate: 667MHz
• Operating Supply Voltage (typ): 1.8V
• Operating Current: 1.136A
• Number Of Elements: 16
• Operating Supply Voltage (max): 1.9V
• Operating Supply Voltage (min): 1.7V
• Operating Temp Range: 0C to 70C
• Operating Temperature Classification: Commercial
• Pin Count: 200
• Mounting: Socket
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

Electrical Specifications
Table 7:
Input Capacitance
AC Timing and Operating Conditions
Table 8:
PDF: 09005aef8339ef97/Source: 09005aef8339eff3
HTF16C128_256x64HZ.fm - Rev. A 5/08 EN
V
Symbol
IN
I
V
VREF
, V
Ioz
T
T
DD
I
C
A
I
1
OUT
Absolute Maximum Ratings
Module and Component Speed Grades
Parameter
V
Voltage on any pin relative to V
Input leakage current; Any input 0V ≤ V
V
test = 0V)
Output leakage current; 0V ≤ V
disabled
V
Module ambient operating temperature
DDR2 SDRAM component case operating
temperature
REF
REF
DD
Module Speed Grade
supply voltage relative to V
Notes:
input 0V ≤ V
leakage current; V
2
Stresses greater than those listed in Table 7 may cause permanent damage to the
module. This is a stress rating only, and functional operation of the module at these or
any other conditions outside those indicated in the device data sheet is not implied.
Exposure to absolute maximum rating conditions for extended periods may adversely
affect reliability.
1. The refresh rate is required to double when 85°C < T
2. For further information, refer to technical note
Micron encourages designers to simulate the performance of the module to achieve
optimum values. Simulations are significantly more accurate and realistic than a gross
estimation of module capacitance when inductance and delay parameters associated
with trace lengths are used in simulations. JEDEC modules are currently designed using
simulations to close timing budgets.
Recommended AC operating conditions are given in the DDR2 component data sheets.
Component specifications are available on Micron’s Web site. Module speed grades
correlate with component speed grades, as shown in Table 8.
-80E
-800
-667
-53E
-40E
on Micron’s Web site.
IN
1GB, 2GB (x64, DR) 200-Pin Halogen-Free DDR2 SDRAM SODIMM
≤ 0.95V (All other pins not under
REF
= valid V
OUT
SS
SS
; DQ and ODT are
REF
level
IN
≤ V
DD
7
;
Address inputs,
RAS#, CAS#, WE#, BA
S#, CKE, ODT, CK, CK#
DM
DQ, DQS, DQS#
Commercial
Industrial
Commercial
Industrial
Micron Technology, Inc., reserves the right to change products or specifications without notice.
Component Speed Grade
TN-00-08: “Thermal
C
≤ 95°C.
Electrical Specifications
-25E
-37E
-53E
-25
-3
©2008 Micron Technology, Inc. All rights reserved
Min
–1.0
–0.5
–80
–40
–10
–10
–32
–40
–40
0
0
Applications,” available
Max
+2.3
+2.3
+80
+40
+10
+10
+32
+70
+85
+85
+95
Units
µA
µA
µA
°C
°C
°C
°C
V
V