MT16HTF25664HZ-667H1 Micron Technology Inc, MT16HTF25664HZ-667H1 Datasheet - Page 4

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MT16HTF25664HZ-667H1

Manufacturer Part Number
MT16HTF25664HZ-667H1
Description
MODULE DDR2 SDRAM 2GB 200SODIMM
Manufacturer
Micron Technology Inc
Series
-r

Specifications of MT16HTF25664HZ-667H1

Memory Type
DDR2 SDRAM
Memory Size
2GB
Speed
667MT/s
Features
-
Package / Case
200-SODIMM
Main Category
DRAM Module
Sub-category
DDR2 SDRAM
Module Type
200SODIMM
Device Core Size
64b
Organization
256Mx64
Total Density
2GByte
Chip Density
128Mb
Access Time (max)
900ns
Package Type
SODIMM
Maximum Clock Rate
667MHz
Operating Supply Voltage (typ)
1.8V
Operating Current
1.136A
Number Of Elements
16
Operating Supply Voltage (max)
1.9V
Operating Supply Voltage (min)
1.7V
Operating Temp Range
0C to 70C
Operating Temperature Classification
Commercial
Pin Count
200
Mounting
Socket
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Table 6:
PDF: 09005aef8339ef97/Source: 09005aef8339eff3
HTF16C128_256x64HZ.fm - Rev. A 5/08 EN
RAS#, CAS#,
CK0, CK0#,
CK1, CK1#
DQS#[7:0]
DQS[7:0],
ODT[1:0]
DQ[63:0]
Symbol
CKE[1:0]
DM[7:0]
A[13:0]
BA[2:0]
SA[1:0]
V
S#[1:0]
WE#
SDA
DDSPD
V
V
SCL
V
NC
REF
DD
SS
Pin Descriptions
(SSTL_18)
(SSTL_18)
(SSTL_18)
(SSTL_18)
(SSTL_18)
(SSTL_18)
(SSTL_18)
(SSTL_18)
(SSTL_18)
(SSTL_18)
(SSTL_18)
(SSTL_18)
(SSTL_18)
Supply
Supply
Supply
Supply
Input
Input
Input
Input
Input
Input
Input
Input
Input
Input
Type
I/O
I/O
I/O
Description
Address inputs: Provide the row address for ACTIVE commands, and the column address and
auto precharge bit (A10) for READ/WRITE commands, to select one location out of the memory
array in the respective bank. A10 sampled during a PRECHARGE command determines whether
the PRECHARGE applies to one device bank (A10 LOW, device bank selected by BA[2/1:0]) or all
device banks (A10 HIGH). The address inputs also provide the op-code during a LOAD MODE
command.
Bank address inputs: BA[2/1:0] define to which device bank an ACTIVE, READ, WRITE, or
PRECHARGE command is being applied. BA[2/1:0] define which mode register, including MR,
EMR, EMR(2), and EMR(3), is loaded during the LOAD MODE command. BA[1:0] (1GB), BA[2:0]
(2GB).
Clock: CK and CK# are differential clock inputs. All address and control input signals are
sampled on the crossing of the positive edge of CK and the negative edge of CK#.
Clock enable: CKE (registered HIGH) activates and CKE (registered LOW) deactivates clocking
circuitry on the DDR2 SDRAM.
Input data mask: DM is an input mask signal for write data. Input data is masked when DM is
sampled HIGH along with that input data during a WRITE access. DM is sampled on both edges
of DQS. Although DM pins are input-only, the DM loading is designed to match that of DQ and
DQS pins.
On-die termination: ODT (registered HIGH) enables termination resistance internal to the
DDR2 SDRAM. When enabled, ODT is only applied to each of the following pins: DQ, DQS,
DQS#, and DM. The ODT input will be ignored if disabled via the LOAD MODE command.
Command inputs: RAS#, CAS#, and WE# (along with S#) define the command being entered.
Chip select: S# enables (registered LOW) and disables (registered HIGH) the command
decoder. All commands are masked when S# is registered HIGH. S# provides for external rank
selection on systems with multiple ranks. S# is considered part of the command code.
Presence-detect address inputs: These pins are used to configure the presence-detect
device.
Serial clock for presence-detect: SCL is used to synchronize the presence-detect data
transfer to and from the module.
Data input/output: Bidirectional data bus.
Data strobe: Output with read data, input with write data for source-synchronous operation.
Edge-aligned with read data, center-aligned with write data. DQS# is only used when
differential data strobe mode is enabled via the LOAD MODE command.
Serial presence-detect data: SDA is a bidirectional pin used to transfer addresses and data
into and out of the presence-detect portion of the module.
Power supply: +1.8V ±0.1V.
Serial EEPROM positive power supply: +1.7V to +3.6V.
SSTL_18 reference voltage (V
Ground.
No connect: These pins should be left unconnected.
1GB, 2GB (x64, DR) 200-Pin Halogen-Free DDR2 SDRAM SODIMM
DD
/2).
4
Micron Technology, Inc., reserves the right to change products or specifications without notice.
Pin Assignments and Descriptions
©2008 Micron Technology, Inc. All rights reserved

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