IDTSTAC9753AXNAED1XR IDT, Integrated Device Technology Inc, IDTSTAC9753AXNAED1XR Datasheet - Page 100

• Manufacturer Part Number: IDTSTAC9753AXNAED1XR
• Description: IC CODEC AC'97 MIC/JACK 32-QFN
• Manufacturer: IDT, Integrated Device Technology Inc
• Type: Audio Codec '97r

Specifications of IDTSTAC9753AXNAED1XR

• Resolution (bits): 20 b
• Number Of Adcs / Dacs: 2 / 2
• Sigma Delta: Yes
• S/n Ratio, Adcs / Dacs (db) Typ: 85 / 92
• Voltage - Supply, Analog: 3.14 V ~ 3.47 V; 4.75 V ~ 5.25 V
• Voltage - Supply, Digital: 3.14 V ~ 3.47 V
• Operating Temperature: 0°C ~ 70°C
• Mounting Type: Surface Mount
• Package / Case: 32-QFN
• Single Supply Voltage (typ): 3.3/5V
• Single Supply Voltage (min): 3.135V
• Single Supply Voltage (max): 3.465/5.25V
• Package Type: VFQFPN
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: STAC9753AXNAED1XR

IDT™
AC’97 2.3 CODECS WITH STEREO MICROPHONE & UNIVERSAL JACK
STAC9752A/9753A
AC’97 2.3 CODECS WITH STEREO MICROPHONE & UNIVERSAL JACK
13.3. PC Board Recommendations for 32-pad QFN Package
0.50 mm typical
NOTES:
1. Oblong pad is preferred geometry.
2. Oblong pad may be replaced with Rectangular pad of the same overall
3. Oblong pad may be replaced with Bullet pad of the same overall dimensions. If
4. Solderpaste shall be oblong pad regardless of the pad geometry. Solderpaste
5. Recommended solderpaste stencil thickness is 0.127 mm, electropolished.
6. Soldermask is to be 1 mm larger in X- and Y-dimensions.
dimensions.
a Bullet pad is used, flat shall be to the outside.
opening shall be the same dimensions as pad detail.
2.375 mm
4.75 mm
SUGGESTED FOOTPRINT
Figure 28. Recommended PCB Layout for 32-pad QFN Package
1
8
32
16
2.375 mm
24
4.75 mm
100
0.375 mm
PAD DETAIL
0.75 mm
STAC9752A/9753A
0.15 mm
0.30 mm
PC AUDIO
V 1.5 1206