MPC885CVR133 Freescale Semiconductor, MPC885CVR133 Datasheet - Page 84

• Manufacturer Part Number: MPC885CVR133
• Description: IC MPU POWERQUICC 133MHZ 357PBGA
• Manufacturer: Freescale Semiconductor

Specifications of MPC885CVR133

• Processor Type: MPC8xx PowerQUICC 32-Bit
• Speed: 133MHz
• Voltage: 3.3V
• Mounting Type: Surface Mount
• Package / Case: 357-PBGA
• Processor Series: MPC8xx
• Core: MPC8xx
• Data Bus Width: 32 bit
• Maximum Clock Frequency: 133 MHz
• Operating Supply Voltage: 0 V to 5 V
• Maximum Operating Temperature: + 95 C
• Mounting Style: SMD/SMT
• Data Ram Size: 8 KB
• I/o Voltage: 5 V
• Interface Type: I2C, SPI, UART
• Minimum Operating Temperature: 0 C
• Program Memory Size: 8 KB
• Program Memory Type: EPROM/Flash
• For Use With: CWH-PPC-885XN-VX - BOARD EVAL QUICCSTART MPC885CWH-PPC-885XN-VE - BOARD EVAL QUICCSTART MPC885
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Features: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

Mechanical Data and Ordering Information
16.2
Figure 78
84
Figure 78. Mechanical Dimensions and Bottom Surface Nomenclature of the PBGA Package
1. ALL DIMENSIONS ARE IN MILLIMETERS.
2. INTERPRET DIMENSIONS AND TOLERANCES PER ASME Y14.5M—1994.
3. MAXIMUM SOLDER BALL DIAMETER MEASURED PARALLEL TO DATUM A.
4. DATUM A, THE SEATING PLANE, IS DEFINED BY THE SPHERICAL CROWNS OF THE SOLDER BALLS.
NOTES:
Mechanical Dimensions of the PBGA Package
shows the mechanical dimensions of the PBGA package.
MPC885/MPC880 PowerQUICC Hardware Specifications, Rev. 7
Freescale Semiconductor