EP2SGX60EF1152I4 Altera, EP2SGX60EF1152I4 Datasheet - Page 140

• Manufacturer Part Number: EP2SGX60EF1152I4
• Description: IC STRATIX II GX 60K 1152-FBGA
• Manufacturer: Altera
• Series: Stratix® II GXr

Specifications of EP2SGX60EF1152I4

• Number Of Logic Elements/cells: 60440
• Number Of Labs/clbs: 3022
• Total Ram Bits: 2544192
• Number Of I /o: 534
• Voltage - Supply: 1.15 V ~ 1.25 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C
• Package / Case: 1152-FBGA
• Family Name: Stratix II GX
• Number Of Logic Blocks/elements: 60440
• # I/os (max): 534
• Frequency (max): 732.1MHz
• Process Technology: SRAM
• Operating Supply Voltage (typ): 1.2V
• Logic Cells: 60440
• Ram Bits: 2544192
• Operating Supply Voltage (min): 1.15V
• Operating Supply Voltage (max): 1.25V
• Operating Temp Range: -40C to 100C
• Operating Temperature Classification: Industrial
• Mounting: Surface Mount
• Pin Count: 1152
• Package Type: FC-FBGA
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Number Of Gates: -
• Lead Free Status / Rohs Status: Not Compliant
• Other names: 544-2186

I/O Structure
2–132
Stratix II GX Device Handbook, Volume 1
f
f
f
f
f
For more information on tolerance specifications for differential on-chip
termination, refer to the
volume 1 of the Stratix II GX Device Handbook.
On-Chip Series Termination without Calibration
Stratix II GX devices support driver impedance matching to provide the
I/O driver with controlled output impedance that closely matches the
impedance of the transmission line. As a result, reflections can be
significantly reduced. Stratix II GX devices support on-chip series
termination for single-ended I/O standards with typical R
25 and 50 Ω . Once matching impedance is selected, current drive
strength is no longer selectable.
standards that support on-chip series termination without calibration.
For more information about series on-chip termination supported by
Stratix II GX devices, refer to the
Stratix II GX Devices
Handbook.
For more information about tolerance specifications for on-chip
termination without calibration, refer to the
Characteristics
On-Chip Series Termination with Calibration
Stratix II GX devices support on-chip series termination with calibration
in column I/O pins in top and bottom banks. There is one calibration
circuit for the top I/O banks and one circuit for the bottom I/O banks.
Each on-chip series termination calibration circuit compares the total
impedance of each I/O buffer to the external 25-Ω or 50-Ω resistors
connected to the RUP and RDN pins, and dynamically enables or disables
the transistors until they match. Calibration occurs at the end of device
configuration. Once the calibration circuit finds the correct impedance, it
powers down and stops changing the characteristics of the drivers.
For more information about series on-chip termination supported by
Stratix II GX devices, refer to the
Stratix II GX Devices
Handbook.
For more information about tolerance specifications for on-chip
termination with calibration, refer to the
chapter in volume 1 of the Stratix II GX Device Handbook.
chapter in volume 1 of the Stratix II GX Device Handbook.
chapter in volume 2 of the Stratix II GX Device
chapter in volume 2 of the Stratix II GX Device
DC & Switching Characteristics
Table 2–34
Selectable I/O Standards in Stratix II &
Selectable I/O Standards in Stratix II &
DC & Switching Characteristics
shows the list of output
DC & Switching
Altera Corporation
chapter in
S
October 2007
values of