DSPB56374AE Freescale Semiconductor, DSPB56374AE Datasheet - Page 7

• Manufacturer Part Number: DSPB56374AE
• Description: IC DSP 24BIT 150MHZ 52-LQFP
• Manufacturer: Freescale Semiconductor
• Series: Symphony™r
• Type: Audio Processorr

Specifications of DSPB56374AE

• Interface: Host Interface, I²C, SAI, SPI
• Clock Rate: 150MHz
• Non-volatile Memory: ROM (84 kB)
• On-chip Ram: 54kB
• Voltage - I/o: 3.30V
• Voltage - Core: 1.25V
• Operating Temperature: -40°C ~ 110°C
• Mounting Type: Surface Mount
• Package / Case: 52-LQFP
• Product: DSPs
• Data Bus Width: 24 bit
• Processor Series: DSP563xx
• Core: 56000
• Numeric And Arithmetic Format: Fixed-Point
• Device Million Instructions Per Second: 150 MIPS
• Maximum Clock Frequency: 150 MHz
• Program Memory Type: Flash
• Program Memory Size: 24 KB
• Data Ram Size: 54 KB
• Operating Supply Voltage: 1.25 V or 3.3 V
• Maximum Operating Temperature: + 110 C
• Mounting Style: SMD/SMT
• Interface Type: SIA, SHI
• Minimum Operating Temperature: - 40 C
• Leaded Process Compatible: Yes
• Rohs Compliant: Yes
• Peak Reflow Compatible (260 C): Yes
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

4.3
4.4
Freescale Semiconductor
PINIT/NMI
CORE_GND(4)
Ground Name
PLLP_GND(1)
PLLD_GND(1)
Signal
EXTAL
Name
XTAL
Signal
IO_GND(2)
Name
SCAN
SCAN
Clock and PLL
Output
Type
Type
Input
Input
Input
PLL Ground—The PLL ground should be provided with an extremely low-impedance path to
ground. This connection must be tied externally to all other chip ground connections. The user
must provide adequate external decoupling capacitors between PLLP_VDD and PLLP_GND.
PLL Ground—The PLL ground should be provided with an extremely low-impedance path to
ground. This connection must be tied externally to all other chip ground connections. The user
must provide adequate external decoupling capacitors between PLLD_VDD and PLLD_GND.
Core Ground—The Core ground should be provided with an extremely low-impedance path to
ground. This connection must be tied externally to all other chip ground connections. The user
must provide adequate external decoupling capacitors.
SHI, ESAI, ESAI_1, WDT and Timer I/O Ground—IO_GND is the ground for the SHI, ESAI,
ESAI_1, WDT and Timer I/O. This connection must be tied externally to all other chip ground
connections. The user must provide adequate external decoupling capacitors.
Chip Driven Crystal Output—Connects the internal Crystal Oscillator output to an external
During
Reset
State
during
Input
Reset
State
Input
Input
SCAN—Manufacturing test pin. This pin must be connected to ground.
External Clock / Crystal Input—An external clock source must be connected
to EXTAL in order to supply the clock to the internal clock generator and PLL.
crystal. If an external clock is used, leave XTAL unconnected.
PLL Initial/Nonmaskable Interrupt—During assertion of RESET, the value of
PINIT/NMI is written into the PLL Enable (PEN) bit of the PLL control register,
determining whether the PLL is enabled or disabled. After RESET
de-assertion and during normal instruction processing, the PINIT/NMI
Schmitt-trigger input is a negative-edge-triggered nonmaskable interrupt
(NMI) request internally synchronized to the internal system clock.
This pin has an internal pull up resistor.
This input is 5 V tolerant.
Table 7. Clock and PLL Signals
Table 5. Grounds (continued)
DSP56374 Data Sheet, Rev. 4.2
Table 6. SCAN Signals
Description
Signal Description
Signal Description
Signal Groupings
7