MT48LC2M32B2P-6:G Micron Technology Inc, MT48LC2M32B2P-6:G Datasheet - Page 31

IC, SDRAM, 64MBIT, 166MHZ, TSOP-86

MT48LC2M32B2P-6:G

Manufacturer Part Number
MT48LC2M32B2P-6:G
Description
IC, SDRAM, 64MBIT, 166MHZ, TSOP-86
Manufacturer
Micron Technology Inc
Type
SDRAMr
Series
-r
Datasheets

Specifications of MT48LC2M32B2P-6:G

Organization
2Mx32
Density
64Mb
Address Bus
13b
Access Time (max)
17/7.5/5.5ns
Maximum Clock Rate
166MHz
Operating Supply Voltage (typ)
3.3V
Package Type
TSOP-II
Operating Temp Range
0C to 70C
Operating Supply Voltage (max)
3.6V
Operating Supply Voltage (min)
3V
Supply Current
180mA
Pin Count
86
Mounting
Surface Mount
Operating Temperature Classification
Commercial
Memory Type
DRAM - Sychronous
Access Time
5.5ns
Page Size
64Mbit
Memory Case Style
TSOP
No. Of Pins
86
Operating Temperature Range
0°C To +70°C
Frequency
166MHz
Supply Voltage
3.3V
Format - Memory
RAM
Memory Size
64M (2Mx32)
Speed
167MHz
Interface
Parallel
Voltage - Supply
3 V ~ 3.6 V
Operating Temperature
0°C ~ 70°C
Package / Case
86-TFSOP (0.400", 10.16mm Width)
Filter Terminals
SMD
Rohs Compliant
Yes
Lead Free Status / RoHS Status
Compliant
Lead Free Status / RoHS Status
Compliant, Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
MT48LC2M32B2P-6:G
Quantity:
106
Part Number:
MT48LC2M32B2P-6:G
Manufacturer:
MICRON
Quantity:
20 000
Figure 23:
PRECHARGE
PDF: 09005aef80725c0b/Source: 09005aef806fc13c
64MSDRAM_2.fm - Rev. M 10/07 EN
WRITE-to-PRECHARGE
Note:
COMMAND
COMMAND
Fixed-length or full-page WRITE bursts can be truncated with the BURST TERMINATE
command. When truncating a WRITE burst, the input data applied coincident with the
BURST TERMINATE command will be ignored. The last data written (provided that
DQM is LOW at that time) will be the input data applied one clock previous to the
BURST TERMINATE command. This is shown in Figure 24 on page 32, where data n is
the last desired data element of a longer burst.
The PRECHARGE command (Figure 25 on page 32) is used to deactivate the open row in
a particular bank or the open row in all banks. The bank(s) will be available for a subse-
quent row access some specified time (
Input A10 determines whether one or all banks are to be precharged, and in the case
where only one bank is to be precharged, inputs BA0, BA1 select the bank. When all
banks are to be precharged, inputs BA0, BA1 are treated as “Don’t Care.” After a bank
has been precharged, it is in the idle state and must be activated prior to any READ or
WRITE commands being issued to that bank.
t WR @ t CLK ≥ 15ns
t WR = t CLK < 15ns
ADDRESS
ADDRESS
DQM could remain LOW in this example if the WRITE burst is a fixed length of two.
DQM
DQM
CLK
DQ
DQ
BANK a,
BANK a,
WRITE
WRITE
COL n
COL n
D
D
T0
n
n
IN
IN
n + 1
n + 1
NOP
NOP
T1
D
D
IN
IN
t
WR
PRECHARGE
(a or all)
BANK
NOP
T2
31
t
WR
TRANSITIONING DATA
PRECHARGE
(a or all)
BANK
T3
NOP
Micron Technology, Inc., reserves the right to change products or specifications without notice.
t
RP) after the PRECHARGE command is issued.
t RP
NOP
NOP
T4
t RP
BANK a,
ACTIVE
ROW
NOP
T5
64Mb: x4, x8, x16 SDRAM
DON’T CARE
BANK a,
ACTIVE
ROW
NOP
T6
©2000 Micron Technology, Inc. All rights reserved.
Commands

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