PIC32MX575F512H-80I/PT Microchip Technology, PIC32MX575F512H-80I/PT Datasheet - Page 178

• Manufacturer Part Number: PIC32MX575F512H-80I/PT
• Description: IC MCU 32BIT 512KB FLASH 64TQFP
• Manufacturer: Microchip Technology
• Series: PIC® 32MXr

Specifications of PIC32MX575F512H-80I/PT

• Core Size: 32-Bit
• Program Memory Size: 512KB (512K x 8)
• Core Processor: MIPS32® M4K™
• Speed: 80MHz
• Connectivity: CAN, I²C, SPI, UART/USART, USB OTG
• Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
• Number Of I /o: 53
• Program Memory Type: FLASH
• Ram Size: 64K x 8
• Voltage - Supply (vcc/vdd): 2.3 V ~ 3.6 V
• Data Converters: A/D 16x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 64-TFQFP
• Controller Family/series: PIC32
• No. Of I/o's: 53
• Ram Memory Size: 64KB
• Cpu Speed: 80MHz
• No. Of Timers: 5
• Digital Ic Case Style: TQFP
• Embedded Interface Type: CAN, I2C, SPI, UART
• Rohs Compliant: Yes
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant

PIC32MX5XX/6XX/7XX
31.1
TABLE 31-1:
TABLE 31-2:
TABLE 31-3:
TABLE 31-4:
DS61156B-page 178
DC5
Note 1:
PIC32MX5XX/6XX/7XX
Power Dissipation:
Internal Chip Power Dissipation:
I/O Pin Power Dissipation:
Maximum Allowed Power Dissipation
Package Thermal Resistance, 121-Pin XBGA (10x10x1.1 mm)
Package Thermal Resistance, 100-Pin TQFP (14x14x1 mm)
Package Thermal Resistance, 100-Pin TQFP (12x12x1 mm)
Package Thermal Resistance, 64-Pin TQFP (10x10x1 mm)
Package Thermal Resistance, 64-Pin QFN (9x9x0,9 mm)
Note 1:
DC CHARACTERISTICS
Operating Voltage
DC10
DC12
DC16
DC17
Note 1:
Characteristic
Param.
No.
Operating Junction Temperature Range
DC Characteristics
P
I/O = S ({V
Operating Ambient Temperature Range
Supply Voltage
V
V
V
S
Symbol
INT
DD
DR
POR
VDD
40 MHz maximum for PIC32MX 40 MHz family variants.
Junction to ambient thermal resistance, Theta-
This is the limit to which V
= V
DD
OPERATING MIPS VS. VOLTAGE
THERMAL OPERATING CONDITIONS
THERMAL PACKAGING CHARACTERISTICS
DC TEMPERATURE AND VOLTAGE SPECIFICATIONS
RAM Data Retention Voltage
(Note 1)
V
to Ensure Internal
Power-on Reset Signal
V
to Ensure Internal
Power-on Reset Signal
DD
x (I
DD
DD
– V
V
DD
(in Volts)
Start Voltage
Rise Rate
DD
2.3-3.6V
Characteristics
OH
– S I
Characteristics
Range
} x I
Rating
OH
OH
)
) + S (V
DD
can be lowered without losing RAM data.
OL
x I
OL
Preliminary
-40°C to +85°C
))
Temp. Range
Standard Operating Conditions: 2.3V to 3.6V
(unless otherwise stated)
Operating temperature
0.00005
(in °C)
Min.
1.75
1.75
2.3
JA
(

JA
) numbers are achieved by package simulations.
Typical
—
—
—
—
Symbol
Symbol Typical
P
DMAX





P
T
T
JA
JA
JA
JA
JA
A
D
J
0.115
Max.
1.95
3.6
—
-40°C  T
Min.
-40
-40
40
43
43
47
28
PIC32MX5XX/6XX/7XX
Units
V/  s
(T
V
V
V
 2009 Microchip Technology Inc.
P
Max. Frequency
80 MHz (Note 1)
A
J
INT
Typical
– T
Max.
 +85°C for Industrial
—
—
—
—
—
—
—
+ P
A
)/ 
I
/
O
JA
Conditions
°C/W
°C/W
°C/W
°C/W
°C/W
Max.
+125
Unit
+85
Notes
Unit
°C
°C
W
W
1
1
1
1
1