PIC16F874-20/L Microchip Technology, PIC16F874-20/L Datasheet - Page 21

• Manufacturer Part Number: PIC16F874-20/L
• Description: IC MCU FLASH 4KX14 EE 44PLCC
• Manufacturer: Microchip Technology
• Series: PIC® 16Fr

Specifications of PIC16F874-20/L

• Core Size: 8-Bit
• Program Memory Size: 7KB (4K x 14)
• Core Processor: PIC
• Speed: 20MHz
• Connectivity: I²C, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
• Number Of I /o: 33
• Program Memory Type: FLASH
• Eeprom Size: 128 x 8
• Ram Size: 192 x 8
• Voltage - Supply (vcc/vdd): 4 V ~ 5.5 V
• Data Converters: A/D 8x10b
• Oscillator Type: External
• Operating Temperature: 0°C ~ 70°C
• Package / Case: 44-PLCC
• Controller Family/series: PIC16F
• No. Of I/o's: 33
• Eeprom Memory Size: 128Byte
• Ram Memory Size: 192Byte
• Cpu Speed: 20MHz
• No. Of Timers: 3
• Processor Series: PIC16F
• Core: PIC
• Data Bus Width: 8 bit
• Data Ram Size: 192 B
• Interface Type: MSSP, PSP, USART
• Maximum Clock Frequency: 20 MHz
• Number Of Programmable I/os: 33
• Number Of Timers: 3
• Operating Supply Voltage: 2 V to 5.5 V
• Maximum Operating Temperature: + 70 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: 52715-96, 52716-328, 52717-734
• Development Tools By Supplier: PG164130, DV164035, DV244005, DV164005, PG164120, ICE2000, DM163022, DV164120
• Minimum Operating Temperature: 0 C
• On-chip Adc: 10 bit, 8 Channel
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: AC164309 - MODULE SKT FOR PM3 44PLCC444-1001 - DEMO BOARD FOR PICMICRO MCUDVA16XL441 - ADAPTER DEVICE ICE 44PLCC309-1040 - ADAPTER 44-PLCC ZIF TO 40-DIP309-1039 - ADAPTER 44-PLCC TO 40-DIPDV007003 - PROGRAMMER UNIVERSAL PROMATE II
• Lead Free Status / Rohs Status: Details

1.5.3
1997 Microchip Technology Inc.
Packaging Varieties
Depending on the development phase of your project, one of three package types would be used:
The first is a device with an erasure window. Typically these are found in packages with a ceramic
body. These devices are used for the development phase, since the device’s program memory
can be erased and reprogrammed many times.
The second package type is a low cost plastic package. This package type is used in production
where device cost is to be kept to a minimum.
Lastly, there is the DIE option. A DIE is an unpackaged device that has been tested. DIEs are
used in low cost designs and designs where board space is at a minimum.
quick summary of this.
Table 1-3:
Windowed
Plastic
DIE
Package Type
Typical Package Uses
Typical Usage
Development Mode
Production
Special Applications, such as those which require minimum board space
Section 1. Introduction
Table 1-3
DS31001A-page 1-9
shows a
1