PIC18F6527-I/PT Microchip Technology, PIC18F6527-I/PT Datasheet - Page 13

IC PIC MCU FLASH 24KX16 64TQFP

PIC18F6527-I/PT

Manufacturer Part Number
PIC18F6527-I/PT
Description
IC PIC MCU FLASH 24KX16 64TQFP
Manufacturer
Microchip Technology
Series
PIC® 18Fr

Specifications of PIC18F6527-I/PT

Program Memory Type
FLASH
Program Memory Size
48KB (24K x 16)
Package / Case
64-TFQFP
Core Processor
PIC
Core Size
8-Bit
Speed
40MHz
Connectivity
I²C, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, HLVD, POR, PWM, WDT
Number Of I /o
54
Eeprom Size
1K x 8
Ram Size
3.8K x 8
Voltage - Supply (vcc/vdd)
4.2 V ~ 5.5 V
Data Converters
A/D 12x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Processor Series
PIC18F
Core
PIC
Data Bus Width
8 bit
Data Ram Size
3936 B
Interface Type
SPI/I2C/EUSART
Maximum Clock Frequency
40 MHz
Number Of Programmable I/os
54
Number Of Timers
5
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
52715-96, 52716-328, 52717-734, 52712-325, EWPIC18
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, PG164120, ICE2000, ICE4000, DV164136, DM183032
Minimum Operating Temperature
- 40 C
On-chip Adc
12-ch x 10-bit
Package
64TQFP
Device Core
PIC
Family Name
PIC18
Maximum Speed
40 MHz
Operating Supply Voltage
5 V
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
XLT64PT5 - SOCKET TRAN ICE 64MQFP/TQFPAC164319 - MODULE SKT MPLAB PM3 64TQFPDV007003 - PROGRAMMER UNIVERSAL PROMATE II
Lead Free Status / Rohs Status
Lead free / RoHS Compliant

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0
FIGURE 3-2:
3.1.2
When using low-voltage ICSP, the part must be
supplied by the voltage specified in parameter, D111, if
a Bulk Erase is to be executed. All other Bulk Erase
details as described above apply.
If it is determined that a program memory erase must
be performed at a supply voltage below the Bulk Erase
limit, refer to the erase methodology described in
Section 3.1.3 “ICSP Row Erase” and Section 3.2.2
“Modifying Code Memory”.
If it is determined that a data EEPROM erase must be
performed at a supply voltage below the Bulk Erase
limit, follow the methodology described in Section 3.3
“Data EEPROM Programming” and write ‘1’s to the
array.
© 2009 Microchip Technology Inc.
PGC
PGD
4-Bit Command
1 2
0 0 1 1
LOW-VOLTAGE ICSP BULK ERASE
3
4
P5
BULK ERASE TIMING
1
Data Payload
1 1
2
16-Bit
15 16
0
0
P5A
4-Bit Command
1
0
2
0 0 0
3
PGD = Input
4
P5
1
Data Payload
0
2
0
16-Bit
3.1.3
Regardless of whether high or low-voltage ICSP is
used, it is possible to erase one row (64 bytes of data)
provided the block is not code or write-protected. Rows
are located at static boundaries, beginning at program
memory address, 000000h, extending to the internal
program memory limit (see Section 2.3 “Memory
Maps”).
The Row Erase duration is externally timed and is
controlled by PGC. After the WR bit in EECON1 is set,
a NOP is issued, where the 4th PGC is held high for the
duration of the programming time, P9.
After PGC is brought low, the programming sequence
is terminated. PGC must be held low for the time
specified by parameter, P10, to allow high-voltage
discharge of the memory array.
The code sequence to Row Erase a PIC18F872X family
device is shown in Table 3-3. The flowchart shown in
Figure 3-3 depicts the logic necessary to completely
erase a PIC18F872X family device. The timing diagram
that details the Start Programming command and
parameters, P9 and P10, is shown in Figure 3-4.
PIC18F872X FAMILY
15 16
Note:
0
0
P5A
4-Bit Command
1
0 0 0 0
ICSP ROW ERASE
The TBLPTR register can point to any byte
within the row intended for erase.
2
3
4
Erase Time
P11
DS39643C-page 13
P10
Data Payload
16-Bit
1
n
2
n

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