PIC16F873-04I/SO Microchip Technology, PIC16F873-04I/SO Datasheet - Page 29

• Manufacturer Part Number: PIC16F873-04I/SO
• Description: IC MCU FLASH 4KX14 EE 28SOIC
• Manufacturer: Microchip Technology
• Series: PIC® 16Fr

Specifications of PIC16F873-04I/SO

• Core Size: 8-Bit
• Program Memory Size: 7KB (4K x 14)
• Core Processor: PIC
• Speed: 4MHz
• Connectivity: I²C, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
• Number Of I /o: 22
• Program Memory Type: FLASH
• Eeprom Size: 128 x 8
• Ram Size: 192 x 8
• Voltage - Supply (vcc/vdd): 4 V ~ 5.5 V
• Data Converters: A/D 5x10b
• Oscillator Type: External
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 28-SOIC (7.5mm Width)
• Controller Family/series: PIC16F
• No. Of I/o's: 22
• Eeprom Memory Size: 128Byte
• Ram Memory Size: 192Byte
• Cpu Speed: 4MHz
• No. Of Timers: 3
• Package: 28SOIC W
• Device Core: PIC
• Family Name: PIC16
• Maximum Speed: 4 MHz
• Operating Supply Voltage: 5 V
• Data Bus Width: 8 Bit
• Number Of Programmable I/os: 22
• Interface Type: I2C/SPI/USART
• On-chip Adc: 5-chx10-bit
• Number Of Timers: 3
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: XLT28SO-1 - SOCKET TRANSITION 28SOIC 300MIL309-1073 - ADAPTER 28-SOIC TO 28-SOIC309-1024 - ADAPTER 28-SOIC TO 28-DIP309-1023 - ADAPTER 28-SOIC TO 28-DIP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant

1.8
1997 Microchip Technology Inc.
Related Application Notes
This section lists application notes that are related to this section of the manual. These applica-
tion notes may not be written specifically for the PIC16CXXX Mid-Range MCU family (that is they
may be written for the Base-Line, or the High-End families), but the concepts are pertinent, and
could be used (with modification and possible limitations). The current application notes related
to an introduction to Microchip’s PICmicro MCUs are:
Title
A Comparison of Low End 8-bit Microcontrollers
PIC16C54A EMI Results
Continuous Improvement
Improving the Susceptibility of an Application to ESD
Plastic Packaging and the Effects of Surface Mount Soldering Techniques
Section 1. Introduction
Application Note #
DS31001A-page 1-17
AN520
AN577
AN503
AN595
AN598
1