MPC8544COMEDEV Freescale Semiconductor, MPC8544COMEDEV Datasheet - Page 98

• Manufacturer Part Number: MPC8544COMEDEV
• Description: KIT DEV EXPRESS MPC8544COM
• Manufacturer: Freescale Semiconductor
• Type: MPUr

Specifications of MPC8544COMEDEV

• Contents: Board
• For Use With/related Products: MPC8544
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

Thermal
The Flotherm library files of the parts have a dense grid to accurately capture the laminar boundary layer
for flow over the part in standard JEDEC environments, as well as the heat spreading in the board under
the package. In a real system, however, the part will require a heat sink to be mounted on it. In this case,
the predominant heat flow path will be from the die to the heat sink. Grid density lower than currently in
the package library file will suffice for these simulations. The user will need to determine the optimal grid
for their specific case.
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Conductivity
Kx
Ky
Kz
Section A-A
MPC8544E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 5
Top View
Figure 60. System Level Thermal Model for MPC8544E (Not to Scale)
Bump Underfill
A
Table 72. MPC8544EThermal Model (continued)
Solder and Air (29 × 29 × 0.58 mm)
Value
0.034
0.034
12.1
Solder/Air
Substrate
Die
Freescale Semiconductor
W/m•K
Units
A