MPC8544COMEDEV Freescale Semiconductor, MPC8544COMEDEV Datasheet - Page 82

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MPC8544COMEDEV

Manufacturer Part Number
MPC8544COMEDEV
Description
KIT DEV EXPRESS MPC8544COM
Manufacturer
Freescale Semiconductor
Type
MPUr
Datasheets

Specifications of MPC8544COMEDEV

Contents
Board
For Use With/related Products
MPC8544
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Package Description
18.2
Figure 59
783 FC-PBGA package without a lid.
82
Notes:
1. All dimensions are in millimeters.
2. Dimensions and tolerances per ASME Y14.5M-1994.
3. Maximum solder ball diameter measured parallel to datum A.
4. Datum A, the seating plane, is determined by the spherical crowns of the solder balls.
5. Parallelism measurement shall exclude any effect of mark on top surface of package.
6. Capacitors may not be present on all parts. Care must be taken not to short exposed metal capacitor pads.
7. All dimensions are symmetric across the package center lines, unless dimensioned otherwise.
Mechanical Dimensions of the MPC8544E FC-PBGA
shows the mechanical dimensions and bottom surface nomenclature of the MPC8544E,
MPC8544E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 5
Figure 59. Mechanical Dimensions and Bottom Surface Nomenclature
of the MPC8544E FC-PBGA without a Lid
Freescale Semiconductor

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