MPC8544COMEDEV Freescale Semiconductor, MPC8544COMEDEV Datasheet - Page 31

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MPC8544COMEDEV

Manufacturer Part Number
MPC8544COMEDEV
Description
KIT DEV EXPRESS MPC8544COM
Manufacturer
Freescale Semiconductor
Type
MPUr
Datasheets

Specifications of MPC8544COMEDEV

Contents
Board
For Use With/related Products
MPC8544
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Timing diagrams for FIFO appear in
Freescale Semiconductor
At recommended operating conditions with L/TVDD of 3.3 V ± 5% or 2.5 V ± 5%
(continued)At recommended operating conditions with L/TVDD of 3.3 V ± 5% or 2.5 V ± 5%
Fall time TX_CLK (80%–20%)
GTX_CLK to FIFO data TXD[7:0], TX_ER, TX_EN
hold time
Note:
1. Data valid t
RX_CLK clock period
RX_CLK duty cycle
RX_CLK peak-to-peak jitter
Rise time RX_CLK (20%–80%)
Fall time RX_CLK (80%–20%)
RXD[7:0], RX_DV, RX_ER setup time to RX_CLK
RX_CLK to RXD[7:0], RX_DV, RX_ER hold time
(Min setup = Cycle time – Max hold).
GTX_CLK
RXD[7:0]
RX_CLK
TXD[7:0]
FITDV
RX_ER
RX_DV
Parameter/Condition
Parameter/Condition
TX_EN
TX_ER
MPC8544E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 5
to GTX_CLK Min setup time is a function of clock period and max hold time.
Table 28. FIFO Mode Transmit AC Timing Specification (continued)
Table 29. FIFO Mode Receive AC Timing Specification
t
t
FIRH
FITH
Figure 11. FIFO Transmit AC Timing Diagram
Figure 12. FIFO Receive AC Timing Diagram
t
t
t
FIR
FIRDV
FIT
t
FITDV
Figure 11
t
FIRH
Valid Data
Symbol
Symbol
t
t
t
and
t
FIRDX
FITDX
t
FIRDV
t
t
FIRR
t
FIRF
FITF
FIRJ
FIR
/t
FIRH
Figure
Enhanced Three-Speed Ethernet (eTSEC), MII Management
t
12.
FITDX
Min
Min
0.5
1.5
0.5
45
t
FIRDX
Typ
Typ
8.0
50
t
t
FITF
FIRF
Max
0.75
Max
0.75
0.75
250
3.0
55
t
FITR
t
FIRR
Unit
Unit
ns
ns
ns
ps
ns
ns
ns
ns
%
Notes
Notes
1
31

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