ADZS-BF527-EZLITE Analog Devices Inc, ADZS-BF527-EZLITE Datasheet - Page 2

• Manufacturer Part Number: ADZS-BF527-EZLITE
• Description: BOARD EVAL ADSP-BF527
• Manufacturer: Analog Devices Inc
• Series: Blackfin®r
• Type: DSPr

Specifications of ADZS-BF527-EZLITE

• Featured Product: Blackfin® BF50x Series Processors
• Contents: Evaluation Board
• Silicon Manufacturer: Analog Devices
• Core Architecture: Blackfin
• Features: USB-based, PC-hosted Tool Set
• Silicon Core Number: ADSP-BF527
• Silicon Family Name: Blackfin
• Rohs Compliant: Yes
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With/related Products: ADSP-BF527
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant

ADSP-BF522/523/524/525/526/527
TABLE OF CONTENTS
General Description ................................................. 3
REVISION HISTORY
2/09—Revision PrG:
Numerous small clarifications and corrections throughout
document.
Updated external crystal connections guidelines
in
Added electrical characteristics ............................
Added total power dissipation data .......................
Added maximum total source/sink (I
to absolute maximum ratings ..............................
Added capacitive loading data .............................
Portable Low-Power Architecture ............................. 3
System Integration ................................................ 3
Processor Peripherals ............................................. 3
Blackfin Processor Core .......................................... 4
Memory Architecture ............................................ 5
DMA Controllers .................................................. 9
Host DMA Port .................................................... 9
Real-Time Clock ................................................. 10
Watchdog Timer ................................................ 10
Timers ............................................................. 10
Up/Down Counter and Thumbwheel Interface .......... 10
Serial Ports ........................................................ 11
Serial Peripheral Interface (SPI) Port ....................... 11
UART Ports ...................................................... 11
TWI Controller Interface ...................................... 12
10/100 Ethernet MAC .......................................... 12
Ports ................................................................ 12
Parallel Peripheral Interface (PPI) ........................... 13
USB On-the-go dual-role device controller ............... 14
Code Security with Lockbox Secure Technology ......... 14
Dynamic Power Management ................................ 14
ADSP-BF523/525/527 Voltage Regulation ................ 15
ADSP-BF522/524/526 Voltage Regulation ................ 16
Clock Signals ..................................................... 16
Figure 6
......................................................
OH
/I
OL
) current
Rev. PrG | Page 2 of 80 | February 2009
Page 17
Page 31
Page 33
Page 36
Page 68
Signal Descriptions ................................................. 22
Specifications ........................................................ 27
289-Ball CSP_BGA Ball assignment ............................ 72
208-Ball CSP_BGA Ball assignment ............................ 75
Outline Dimensions ................................................ 78
Ordering Guide ..................................................... 80
Booting Modes ................................................... 18
Instruction Set Description .................................... 20
Development Tools .............................................. 21
Designing an Emulator-Compatible
Related Documents .............................................. 21
Lockbox Secure Technology Disclaimer .................... 21
Operating Conditions for ADSP-BF522/524/526 ......... 27
Operating Conditions for ADSP-BF523/525/527 ......... 29
Electrical Characteristics ....................................... 31
Absolute Maximum Ratings ................................... 36
ESD Sensitivity ................................................... 37
Package Information ............................................ 37
Timing Specifications ........................................... 38
Output Drive Currents ......................................... 64
Test Conditions .................................................. 67
Environmental Conditions .................................... 71
Surface Mount Design .......................................... 79
Processor Board (Target) ................................... 21
Preliminary Technical Data