LTM8032IV#PBF Linear Technology, LTM8032IV#PBF Datasheet - Page 14

IC BUCK ADJ 2A 71LGA

LTM8032IV#PBF

Manufacturer Part Number
LTM8032IV#PBF
Description
IC BUCK ADJ 2A 71LGA
Manufacturer
Linear Technology
Series
µModuler
Type
Point of Load (POL) Non-Isolatedr
Datasheet

Specifications of LTM8032IV#PBF

Design Resources
LTM8032 Spice Model
Output
0.8 ~ 10 V
Number Of Outputs
1
Power (watts)
20W
Mounting Type
Surface Mount
Voltage - Input
3.6 ~ 36 V
Package / Case
71-LGA
1st Output
0.8 ~ 10 VDC @ 2A
Size / Dimension
0.59" L x 0.35" W x 0.11" H (15mm x 9mm x 2.8mm)
Power (watts) - Rated
20W
Operating Temperature
-40°C ~ 125°C
Approvals
EN
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
3rd Output
-
2nd Output
-

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Part Number:
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APPLICATIONS INFORMATION
LTM8032
The junction to air and junction to board thermal resistances
given in the Pin Confi guration diagram may also be used
to estimate the LTM8032 internal temperature. These
thermal coeffi cients are determined per JESD 51-9 (JEDEC
standard, test boards for area array surface mount package
thermal measurements) through analysis and physical
correlation. Bear in mind that the actual thermal resistance
of the LTM8032 to the printed circuit board depends upon
the design of the circuit board. The die temperature of
the LTM8032 must be lower than the maximum rating of
125°C, so care should be taken in the layout of the circuit
14
24V SUPPLY
IMPEDANCE
ENERGIZED
Figure 5. A Well Chosen Input Network Prevents Input Voltage Overshoot and Ensures
Reliable Operation When the LTM8032 is Hot-Plugged to a Live Supply
LOW
+
+
+
SIMULATES HOT PLUG
CLOSING SWITCH
AI.EI.
0.1μF
22μF
35V
STRAY
INDUCTANCE
DUE TO 6 FEET
(2 METERS) OF
TWISTED PAIR
+
0.7Ω
I
IN
4.7μF
4.7μF
4.7μF
V
V
FIN
V
IN
IN
IN
LTM8032
LTM8032
LTM8032
(5a)
(5b)
(5c)
to ensure good heat sinking of the LTM8032.
The bulk of the heat fl ow out of the LTM8032 is through the
bottom of the module and the LGA pads into the printed
circuit board. Consequently a poor printed circuit board
design can cause excessive heating, resulting in impaired
performance or reliability. Please refer to the PCB Layout
section for printed circuit board design suggestions.
Finally, be aware that at high ambient temperatures the
internal Schottky diode will have signifi cant leakage current,
increasing the input quiescent current of the LTM8032.
20V/DIV
10A/DIV
20V/DIV
10A/DIV
20V/DIV
10A/DIV
V
V
V
I
I
I
IN
IN
IN
IN
IN
IN
DANGER
RINGING V
ABSOLUTE MAXIMUM RATING
20μs/DIV
20μs/DIV
20μs/DIV
IN
MAY EXCEED
8032 F05
8032fc

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