MT18VDDT12872AG-335F1 Micron Technology Inc, MT18VDDT12872AG-335F1 Datasheet - Page 20

• Manufacturer Part Number: MT18VDDT12872AG-335F1
• Description: MODULE DDR 1GB 184-DIMM
• Manufacturer: Micron Technology Inc

Specifications of MT18VDDT12872AG-335F1

• Memory Type: DDR SDRAM
• Memory Size: 1GB
• Speed: 333MT/s
• Package / Case: 184-DIMM
• Main Category: DRAM Module
• Sub-category: DDR SDRAM
• Module Type: 184UDIMM
• Device Core Size: 72b
• Organization: 128Mx72
• Total Density: 1GByte
• Chip Density: 512Mb
• Maximum Clock Rate: 333MHz
• Operating Supply Voltage (typ): 2.5V
• Operating Current: 1.62A
• Number Of Elements: 18
• Operating Supply Voltage (max): 2.7V
• Operating Supply Voltage (min): 2.3V
• Operating Temp Range: 0C to 70C
• Operating Temperature Classification: Commercial
• Pin Count: 184
• Mounting: Socket
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant

pdf: 09005aef80814e61, source: 09005aef80a43eed
DDA18C32_64_128x72AG.fm - Rev. E 9/04 EN
22. The valid data window is derived by achieving
23. Each byte lane has a corresponding DQS.
24. This limit is actually a nominal value and does not
25. To maintain a valid level, the transitioning edge of
26. CK and CK# input slew rate must be
27. DQ and DM input slew rates must not deviate
28. V
29. The clock is allowed up to ±150ps of jitter. Each
30.
Figure 7: Pull-Down Characteristics
controller greater than eight refresh cycles is not
allowed.
other specifications:
(
in direct porportion to the clock duty cycle and a
practical data valid window can be derived. The
clock is allowed a maximum duty cycle variation
of 45/55. Functionality is uncertain when operat-
ing beyond a 45/55 ratio.
result in a fail value. CKE is HIGH during
REFRESH command period (
CKE is LOW (i.e., during standby).
the input must:
ns differentially).
from DQS by more than 10 percent. DQ/DM/DQS
slew rates less than 0.5V/ns are not allowed. If slew
rate exceeds 4V/ns, functionality is uncertain.
not active while any bank is active.
timing parameter is allowed to vary by the same
amount.
t
minimum actually applied to the device CK and
CK/ inputs, collectively during bank active.
HP min is the lesser of
a. Sustain a constant slew rate from the current
b. Reach at least the target AC level.
c. After the AC target level is reached, continue to
t
QH =
DD
AC level through to the target AC level, V
or V
maintain at least the target DC level, V
or V
must not vary more than 4 percent if CKE is
t
IH
IH
HP -
(AC).
(DC).
t
QHS). The data valid window derates
t
HP (
t
t
CK/2),
CL minimum and
t
RFC [MIN]) else
t
DQSQ, and
256MB, 512MB, 1GB (x72, ECC, DR), PC3200
1V/ns (2V/
IL
IL
(DC)
(AC)
t
t
QH
CH
20
31. READs and WRITEs with auto precharge are not
32. Any positive glitch must be less than 1/3 of the
33. Normal Output Drive Curves:
allowed to be issued until
fied prior to the internal precharge command
being issued.
clock and not more than +400mV or 2.9V, which-
ever is less. Any negative glitch must be less than 1/
3 of the clock cycle and not exceed either -300mV
or 2.4V, whichever is more positive. However, the
DC average cannot be below 2.5V minimum.
Figure 8: Pull-Up Characteristics
a. The full variation in driver pull-down current
b. The variation in driver pull-down current
c. The full variation in driver pull-up current
d. The variation in driver pull-up current within
e. The full variation in the ratio of the maximum
Micron Technology, Inc., reserves the right to change products or specifications without notice.
184-PIN DDR SDRAM UDIMM
from minimum to maximum process, temper-
ature and voltage will lie within the outer
bounding lines of the V-I curve of Figure 7,
Pull-Down Characteristics, on page 20.
within nominal limits of voltage and tempera-
ture is expected, but not guaranteed, to lie
within the inner bounding lines of the V-I
curve of Figure 7, Pull-Down Characteristics,
on page 20.
from minimum to maximum process, temper-
ature and voltage will lie within the outer
bounding lines of the V-I curve of Figure 8,
Pull-Up Characteristics, on page 20.
nominal limits of voltage and temperature is
expected, but not guaranteed, to lie within the
inner bounding lines of the V-I curve of
Figure 8, Pull-Up Characteristics, on page 20.
to minimum pull-up and pull-down current
should be between 0.71 and 1.4, for device
drain-to-source voltages from 0.1V to 1.0V, and
at the same voltage and temperature.
t
RAS(MIN) can be satis-
©2004 Micron Technology, Inc.