PC357N1TJ00F Sharp Microelectronics, PC357N1TJ00F Datasheet
PC357N1TJ00F
Specifications of PC357N1TJ00F
PC357N1TJ00F
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PC357N1TJ00F Summary of contents
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PC357NJ0000F Series ■ Description PC357NJ0000F Series contains an IRED optically coupled to a phototransistor packaged in a 4-pin Mini-flat package. Input-output isolation voltage(rms) is 3.75kV. Collector-emitter voltage is 80V and CTR is 50% to 600% at input current ...
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Internal Connection Diagram 1 2 ■ Outline Dimensions ±0.3 3.6 ±0.25 2. SHARP mark "S" Anode mark 1 2 ±0.1 0.4 Epoxy resin Product mass : approx. 0.1g Anode 1 4 Cathode 2 Emitter ...
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Date code (2 digit) 1st digit Year of production A.D. Mark A.D Mark 1990 A 2002 P 1991 B 2003 R 1992 C 2004 S 1993 D 2005 T 1994 E 2006 U 1995 F 2007 V 1996 H 2008 ...
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Absolute Maximum Ratings Parameter Symbol Forward current Peak forward current I FM Reverse voltage V R Power dissipation P Collector-emitter voltage V CEO Emitter-collector voltage V ECO Collector current I C Collector power dissipation P C ...
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... Model Line-up Taping Package 3 000pcs/reel 750pcs/reel PC357NJ0000F PC357NTJ000F PC357N1J000F PC357N1TJ00F PC357N2J000F PC357N2TJ00F PC357N3J000F PC357N3TJ00F PC357N4J000F PC357N4TJ00F Model No. PC357N5J000F PC357N5TJ00F PC357N6J000F PC357N6TJ00F PC357N7J000F PC357N7TJ00F PC357N8J000F PC357N8TJ00F PC357N9J000F PC357N9TJ00F PC357N0J000F PC357N0TJ00F Please contact a local SHARP sales representative to inquire about production status. I [mA] ...
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Fig.1 Forward Current vs. Ambient Temperature − Ambient temperature T Fig.3 Collector Power Dissipation vs. Ambient Temperature 200 150 100 50 0 − Ambient temperature ...
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Fig.7 Current Transfer Ratio vs. Forward Current 500 400 300 200 100 0 0.1 1 Forward current I F Fig.9 Relative Current Transfer Ratio vs. Ambient Temperature 150 100 50 0 − Ambient temperature Ta (˚C) Fig.11 ...
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Fig.13 Test Circuit for Response Time V CC Input R L Input R Output Output Please refer to the conditions in Fig.12 Remarks : Please be aware that all data in the graph are just ...
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Design Considerations ■ Design Considerations ● Design guide While operating at I <1.0mA, CTR variation may increase. F Please make design considering this fact. This product is not designed against irradiation and incorporates non-coherent IRED. ● Degradation In general, ...
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Manufacturing Guidelines ● Soldering Method Reflow Soldering: Reflow soldering should follow the temperature profile shown below. Soldering should not exceed the curve of temperature profile and time. Please don't solder more than twice. (˚C) 300 Terminal : 260˚C peak ...
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Cleaning instructions Solvent cleaning: Solvent temperature should be 45˚C or below Immersion time should be 3 minutes or less Ultrasonic cleaning: The impact on the device varies depending on the size of the cleaning bath, ultrasonic output, cleaning time, ...
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Package specification ● Tape and Reel package 1. 3 000pcs/reel Package materials Carrier tape : A-PET (with anti-static material) Cover tape : PET (three layer system) Reel : PS Carrier tape structure and Dimensions F Dimensions List A ±0.3 ...
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Package materials Carrier tape : A-PET (with anti-static material) Cover tape : PET (three layer system) Reel : PS Carrier tape structure and Dimensions F Dimensions List A B ±0.3 ±0.1 12.0 5 ±0.1 ±0.05 7.4 ...
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Important Notices · The circuit application examples in this publication are provided to explain representative applications of SHARP devices and are not intended to guarantee any circuit design or license any intellectual property rights. SHARP takes no responsibility for ...