PC357N1 Sharp Microelectronics, PC357N1 Datasheet
PC357N1
Specifications of PC357N1
Available stocks
Related parts for PC357N1
PC357N1 Summary of contents
Page 1
PC357N Series ■ Description PC357N Series contains an IRED optically coupled to a phototransistor packaged in a 4-pin Mini-flat package. Input-output isolation voltage(rms) is 3.75kV. Collector-emitter voltage is 80V (∗) to 600% at input current of 5mA. ■ ...
Page 2
Internal Connection Diagram 1 2 ■ Outline Dimensions ±0.3 3.6 ±0.25 2. SHARP mark "S" Anode mark 1 2 ±0.1 0.4 Epoxy resin Anode 1 4 Cathode 2 Emitter 3 3 Collector 4 (Unit ...
Page 3
Date code (2 digit) 1st digit Year of production A.D. Mark A.D Mark 1990 A 2002 P 1991 B 2003 R 1992 C 2004 S 1993 D 2005 T 1994 E 2006 U 1995 F 2007 V 1996 H 2008 ...
Page 4
Absolute Maximum Ratings Parameter Symbol Forward current Peak forward current I FM Reverse voltage V R Power dissipation P Collector-emitter voltage V CEO Emitter-collector voltage V ECO Collector current I C Collector power dissipation P C ...
Page 5
... Model Line-up Taping Package 3 000pcs/reel 750pcs/reel PC357N PC357NT PC357N1 PC357N1T PC357N2 PC357N2T PC357N3 PC357N3T PC357N4 PC357N4T Model No. PC357N5 PC357N5T PC357N6 PC357N6T PC357N7 PC357N7T PC357N8 PC357N8T PC357N9 PC357N9T PC357N0 PC357N0T Please contact a local SHARP sales representative to inquire about production status and Lead-Free options. ...
Page 6
Fig.1 Forward Current vs. Ambient Temperature − Ambient temperature T Fig.3 Collector Power Dissipation vs. Ambient Temperature 200 150 100 50 0 − Ambient temperature ...
Page 7
Fig.7 Current Transfer Ratio vs. Forward Current 500 400 300 200 100 0 0.1 1 Forward current I F Fig.9 Relative Current Transfer Ratio vs. Ambient Temperature 150 100 50 0 − Ambient temperature Ta (˚C) Fig.11 ...
Page 8
Fig.13 Test Circuit for Response Time V CC Input R L Input R Output Output Please refer to the conditions in Fig.12 Remarks : Please be aware that all data in the graph are just ...
Page 9
Design Considerations ■ Design Considerations ● Design guide While operating at I <1.0mA, CTR variation may increase. F Please make design considering this fact. This product is not designed against irradiation and incorporates non-coherent IRED. ● Degradation In general, ...
Page 10
Manufacturing Guidelines ● Soldering Method Reflow Soldering: Reflow soldering should follow the temperature profile shown below. Soldering should not exceed the curve of temperature profile and time. Please don't solder more than twice. (˚C) 300 Terminal : 260˚C peak ...
Page 11
Cleaning instructions Solvent cleaning: Solvent temperature should be 45˚C or below Immersion time should be 3minutes or less Ultrasonic cleaning: The impact on the device varies depending on the size of the cleaning bath, ultrasonic output, cleaning time, size ...
Page 12
Package specification ● Tape and Reel package 1. 3 000pcs/reel Package materials Carrier tape : A-PET (with anti-static material) Cover tape : PET (three layer system) Reel : PS Carrier tape structure and Dimensions F Dimensions List A ±0.3 ...
Page 13
Package materials Carrier tape : A-PET (with anti-static material) Cover tape : PET (three layer system) Reel : PS Carrier tape structure and Dimensions F Dimensions List A B ±0.3 ±0.1 12.0 5 ±0.1 ±0.05 7.4 ...
Page 14
Important Notices · The circuit application examples in this publication are provided to explain representative applications of SHARP devices and are not intended to guarantee any circuit design or license any intellectual property rights. SHARP takes no responsibility for ...