IDT89HPES64H16ZABR IDT, Integrated Device Technology Inc, IDT89HPES64H16ZABR Datasheet - Page 2

• Manufacturer Part Number: IDT89HPES64H16ZABR
• Description: IC PCI SW 64LANE 16PORT 1156BGA
• Manufacturer: IDT, Integrated Device Technology Inc

Specifications of IDT89HPES64H16ZABR

• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Other names: 89HPES64H16ZABR

Product Description
the most efficient system interconnect switching for applications
requiring high throughput, low latency, and simple board layout with a
IDT 89HPES64H16 Data Sheet
Utilizing standard PCI Express interconnect, the PES64H16 provides
◆
◆
◆
◆
Power Management
Testability and Debug Features
Thirty-two General Purpose Input/Output pins
Packaged in a 35mm x 35mm 1156-ball Flip Chip BGA with
1mm ball spacing
– Internal end-to-end parity protection on all TLPs ensures data
– Supports optional PCI Express Advanced Error Reporting
– Supports PCI Express Hot-Plug
– Supports Hot-Swap
– Supports PCI Power Management Interface specification,
– Unused SerDes disabled
– Built in SerDes Pseudo-Random Bit Stream (PRBS) generator
– Ability to read and write any internal register via the SMBus
– Ability to bypass link training and force any link into any mode
– Provides statistics and performance counters
– Each pin may be individually configured as an input or output
– Each pin may be individually configured as an interrupt input
– Some pins have selectable alternate functions
Note: The configurations in the above diagram show the maximum port widths. The PES64H16 can negotiate to narrower port widths —
x4, x2, or x1.
• Compatible with Hot-Plug I/O expanders used on PC
• Supports powerdown modes at the link level (L0, L0s, L1,
integrity even in systems that do not implement end-to-end
CRC (ECRC)
Revision 1.1 (PCI-PM)
motherboards
L2/L3 Ready and L3) and at the device level (D0, D3
x8
x8
4
5
6
7
Non-bifurcated
3 2
8 9
x8
x8
10 11
1 0
x8
x8
Figure 2 Port Configuration Examples
15
14
13
12
hot
)
x8
x8
2 of 49
minimum number of board layers. It provides 256 Gbps of aggregated,
full-duplex switching capacity through 64 integrated serial lanes, using
proven and robust IDT technology. Each lane provides 2.5 Gbps of
bandwidth in both directions and is fully compliant with PCI Express
Base specification 1.1.
ture. The PCI Express layer consists of SerDes, Physical, Data Link and
Transaction layers. The PES64H16 can operate either as a store and
forward switch or a cut-through switch and is designed to switch memory
and I/O transactions. It supports eight Traffic Classes (TCs) and two
Virtual Channels (VC) with sophisticated resource management to
enable efficient switching and I/O connectivity.
SMBus Interface
provides full access to the configuration registers in the PES64H16,
allowing every configuration register in the device to be read or written
by an external agent. The master interface allows the default configura-
tion register values of the PES64H16 to be overridden following a reset
with values programmed in an external serial EEPROM. The master
interface is also used by an external Hot-Plug I/O expander.
consist of an SMBus clock pin, an SMBus data pin, and 4 SMBus
address pins. In the slave interface, these address pins allow the SMBus
address to which the device responds to be configured. In the master
interface, these address pins allow the SMBus address of the serial
configuration EEPROM from which data is loaded to be configured. The
SMBus address is set up on negation of PERSTN by sampling the
corresponding address pins. When the pins are sampled, the resulting
address is assigned as shown in Table 1.
x4
x4
x4
x4
The PES64H16 is based on a flexible and efficient layered architec-
The PES64H16 contains two SMBus interfaces. The slave interface
Six pins make up each of the two SMBus interfaces. These pins
7
4
5
6
8
3
x4
x4
Fully Bifurcated
9
2
x4
x4
10
1
x4
x4
11
0
x4
x4
15
14
13
12
x4
x4
x4
x4
October 7, 2008