IDT89HPES24T6G2ZBALG IDT, Integrated Device Technology Inc, IDT89HPES24T6G2ZBALG Datasheet - Page 17

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IDT89HPES24T6G2ZBALG

Manufacturer Part Number
IDT89HPES24T6G2ZBALG
Description
IC PCI SW 24LANE 6PORT 324-FCBGA
Manufacturer
IDT, Integrated Device Technology Inc

Specifications of IDT89HPES24T6G2ZBALG

Operating Temperature (min)
0C
Operating Temperature Classification
Commercial
Operating Temperature (max)
70C
Package Type
FCBGA
Rad Hardened
No
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
89HPES24T6G2ZBALG

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Manufacturer
Quantity
Price
Part Number:
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Manufacturer:
IDT, Integrated Device Technology Inc
Quantity:
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Part Number:
IDT89HPES24T6G2ZBALG8
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Quantity:
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IDT 89HPES24T6G2 Data Sheet
Note: It is important for the reliability of this device in any user environment that the junction temperature not exceed the T
specified in Table 17. Consequently, the effective junction to ambient thermal resistance (
maintained below the value determined by the formula:
Given that the values of T
achieve the desired
provided in Table 17), thermal resistance of the chosen adhesive (
circuit board (number of layers and size of the board). As a general guideline, this device will not need a heat sink if the board has 8 or more
layers AND the board size is larger than 4"x12" AND airflow in excess of 0.5 m/s is available. It is strongly recommended that users perform
their own thermal analysis for their own board and system design scenarios.
θ
Symbol
JA(effective)
θ
θ
P
JC
JB
θ
JA
= (T
J(max)
Effective Thermal Resistance, Junction-to-Ambient
θ
- T
JA
Thermal Resistance, Junction-to-Board
Thermal Resistance, Junction-to-Case
A(max)
is left up to the board or system designer, but in general, it can be achieved by adding the effects of
J(max)
Table 18 Thermal Specifications for PES24T6G2, 27x27 mm FCBGA676 Package
Power Dissipation of the Device
)/P
, T
Parameter
A(max)
, and P are known, the value of desired
17 of 51
θ
CS
Value
14.6
4.31
), that of the heat sink (
8.2
7.2
3.1
0.3
θ
JA
Units
becomes a known entity to the system designer. How to
Watts
o
o
o
o
o
C/W
C/W
C/W
C/W
C/W
θ
JA
) for the worst case scenario must be
θ
SA
), amount of airflow, and properties of the
Conditions
1 m/S air flow
2 m/S air flow
Zero air flow
Maximum
February 2, 2010
J(max)
θ
JC
(value
value

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