LTC1735IGN#PBF Linear Technology, LTC1735IGN#PBF Datasheet - Page 31

• Manufacturer Part Number: LTC1735IGN#PBF
• Description: IC SW REG STEP-DOWN SYNC 16-SSOP
• Manufacturer: Linear Technology
• Type: Step-Down (Buck)r

Specifications of LTC1735IGN#PBF

• Internal Switch(s): No
• Synchronous Rectifier: Yes
• Number Of Outputs: 1
• Voltage - Output: 0.8 ~ 6 V
• Current - Output: 3A
• Frequency - Switching: 300kHz
• Voltage - Input: 4 ~ 30 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 16-SSOP
• Number Of Pwm Outputs: 1
• On/off Pin: No
• Adjustable Output: Yes
• Topology: Boost/Buck/Flyback
• Switching Freq: 500KHz
• Duty Cycle: 99.4%
• Operating Supply Voltage (max): 36V
• Output Current: 3000A
• Output Voltage: 0.8 to 6V
• Synchronous Pin: Yes
• Rise Time: 50ns
• Fall Time: 50ns
• Operating Temperature Classification: Industrial
• Mounting: Surface Mount
• Pin Count: 16
• Package Type: SSOP N
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Power - Output: -
• Lead Free Status / Rohs Status: Compliant

PACKAGE
(0.178 – 0.249)
NOTE:
1. CONTROLLING DIMENSION: INCHES
2. DIMENSIONS ARE IN
3. DRAWING NOT TO SCALE
.007 – .0098
NOTE:
1. CONTROLLING DIMENSION: MILLIMETERS
2. DIMENSIONS ARE IN
3. DRAWING NOT TO SCALE
(.0036 – .0079)
0.09 – 0.20
(0.38 0.10)
.015 .004
(0.406 – 1.270)
(.169 – .177)
(MILLIMETERS)
.016 – .050
4.30 – 4.50**
(.018 – .030)
0.45 – 0.75
MILLIMETERS
INCHES
DESCRIPTION
(INCHES)
.030 .005
(0.203 – 0.254)
45
.008 – .010
TYP
.245
MIN
**DIMENSION DOES NOT INCLUDE INTERLEAD FLASH. INTERLEAD
(0.254 – 0.508)
*DIMENSION DOES NOT INCLUDE MOLD FLASH. MOLD FLASH
0 – 8 TYP
RECOMMENDED SOLDER PAD LAYOUT
NOTE:
1. DIMENSIONS IN
2. DRAWING NOT TO SCALE
SHALL NOT EXCEED 0.006" (0.152mm) PER SIDE
FLASH SHALL NOT EXCEED 0.010" (0.254mm) PER SIDE
.010 – .020
N
1
.050 BSC
(0.203 – 0.305)
**
*
(0.406 – 1.270)
.008 – .012
DIMENSIONS DO NOT INCLUDE MOLD FLASH. MOLD FLASH
SHALL NOT EXCEED .152mm (.006") PER SIDE
DIMENSIONS DO NOT INCLUDE INTERLEAD FLASH. INTERLEAD
FLASH SHALL NOT EXCEED .254mm (.010") PER SIDE
.016 – .050
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no represen-
tation that the interconnection of its circuits as described herein will not infringe on existing patent rights.
2
0 – 8
(1.351 – 1.727)
.053 – .068
45
3
(.0256)
(MILLIMETERS)
0.65
BSC
INCHES
U
16-Lead Plastic Small Outline (Narrow .150 Inch)
(.0077 – .0118)
0.195 – 0.30
0 – 8 TYP
16-Lead Plastic SSOP (Narrow .150 Inch)
N/2
.045 .005
.160 .005
3. THESE DIMENSIONS DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS.
MOLD FLASH OR PROTRUSIONS SHALL NOT EXCEED .006" (0.15mm)
(Reference LTC DWG # 05-08-1641)
(Reference LTC DWG # 05-08-1610)
20-Lead Plastic TSSOP (4.4mm)
(Reference LTC DWG # 05-08-1650)
(0.635)
.0250
BSC
(5.791 – 6.197)
(1.346 – 1.752)
(0.102 – 0.249)
.228 – .244
.004 – .0098
.053 – .069
GN Package
S Package
(0.355 – 0.483)
F Package
(.002 – .006)
0.05 – 0.15
.014 – .019
(5.817 – 6.198)
TYP
.229 – .244
(.0433)
MAX
1.10
16
N
1
20 19 18 17 16 15
1
15
2
16 15 14 13
1
2
3 4 5 6 7 8 9 10
2 3
14
(4.801 – 4.978)
3
(.252 – .260)
.189 – .196*
6.40 – 6.60*
(9.804 – 10.008)
4
.386 – .394
13
4
12 11 10 9
NOTE 3
5 6 7
14 13
(1.270)
.050
BSC
12
5
12
8
11
11
6
(3.810 – 3.988)
.150 – .157**
6.40
BSC
(0.229)
10
.009
7
REF
6.60 0.10
0.45 0.05
N/2
9
8
RECOMMENDED SOLDER PAD LAYOUT
.0165 .0015
.254 MIN
RECOMMENDED SOLDER PAD LAYOUT
(3.810 – 3.988)
(0.101 – 0.254)
.150 – .157
.004 – .010
NOTE 3
S16 0502
LTC1735
0.65 TYP
.045 .005
.150 – .165
4.50 0.10
1.05 0.10
F20 TSSOP 0502
GN16 (SSOP) 0502
31
.0250 TYP
1735fc