FAN2012MPX Fairchild Semiconductor, FAN2012MPX Datasheet - Page 3

IC CONV DC/DC 1.5A ADJ STDN 6MLP

FAN2012MPX

Manufacturer Part Number
FAN2012MPX
Description
IC CONV DC/DC 1.5A ADJ STDN 6MLP
Manufacturer
Fairchild Semiconductor
Type
Step-Down (Buck)r
Datasheet

Specifications of FAN2012MPX

Internal Switch(s)
Yes
Synchronous Rectifier
Yes
Number Of Outputs
1
Voltage - Output
0.8 ~ 5.5 V
Current - Output
1.5A
Frequency - Switching
1.3MHz
Voltage - Input
4.5 ~ 5.5 V
Operating Temperature
0°C ~ 85°C
Mounting Type
Surface Mount
Package / Case
6-MLP
Mounting Style
SMD/SMT
Output Current
1.5 A
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Power - Output
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
FAN2012MPXTR
FAN2012MPX_NL
FAN2012MPX_NLTR
FAN2012MPX_NLTR

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FAN2011/FAN2012 Rev. 1.0.4
Absolute Maximum Ratings
Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a
stress rating only and functional operation of the device at these or any other conditions above those indicated in the
operational section of this specification is not implied. Exposure to absolute maximum rating conditions for extended
periods may affect device reliability. Absolute maximum ratings apply individually only, not in combination. Unless
otherwise specified, all other voltages are referenced to AGND.
Recommended Operating Conditions
Notes:
1. Junction to ambient thermal resistance,
2. Using Mil Std. 883E, method 3015.7(Human Body Model) and EIA/JESD22C101-A (Charge Device Model).
3. Refer to the applications section for further details.
V
PV
Thermal Resistance-Junction to Tab (
Lead Soldering Temperature (10 seconds)
Storage Temperature
Junction Temperature
Electrostatic Discharge (ESD) Protection Level
Supply Voltage Range
Output Voltage Range, Adjustable Version
Output Current
Inductor
Input Capacitor
Output Capacitor
Operating Ambient Temperature
Range
number of copper planes, number of via used, diameter of via used, available copper surface, and attached heat sink
characteristics.
IN
IN
and any other pin
(3)
(3)
(3)
Parameter
Parameter
FAN2011 and FAN2012
FAN2011I and FAN2012I
JC
), 3mm x 3mm 6-lead MLP
JA
, is a strong function of PCB material, board thickness, thickness and
(2)
3
(1)
Min.
CDM
HBM
4.5
0.8
-40
0
4 x 10
Typ.
Min.
3.3
-0.3
-0.3
10
-65
-40
4
2
Max.
1500
Max.
+85
+85
150
150
5.5
V
260
V
7
8
IN
IN
www.fairchildsemi.com
°C/W
Unit
Unit
mA
kV
°C
°C
°C
°C
V
V
V
V
H
F
F

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