MAX16834AUP+T Maxim Integrated Products, MAX16834AUP+T Datasheet - Page 2

• Manufacturer Part Number: MAX16834AUP+T
• Description: IC LED DRVR HIGH BRIGHT 20-TSSOP
• Manufacturer: Maxim Integrated Products
• Type: HBLED Driverr

Specifications of MAX16834AUP+T

• Topology: PWM, SEPIC, Step-Down (Buck), Step-Up (Boost)
• Number Of Outputs: 1
• Internal Driver: No
• Type - Primary: Automotive, Backlight
• Type - Secondary: High Brightness LED (HBLED), RGB
• Frequency: 100kHz ~ 1MHz
• Voltage - Supply: 4.75 V ~ 28 V
• Mounting Type: Surface Mount
• Package / Case: 20-TSSOP Exposed Pad, 20-eTSSOP, 20-HTSSOP
• Operating Temperature: -40°C ~ 125°C
• Internal Switch(s): Yes
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Voltage - Output: -
• Current - Output / Channel: -
• Efficiency: -
• Lead Free Status / Rohs Status: Details

High-Power LED Driver with Integrated High-Side LED
Current Sense and PWM Dimming MOSFET Driver
ABSOLUTE MAXIMUM RATINGS
IN, HV, LV to SGND................................................-0.3V to +30V
OVP+, SENSE+, DIMOUT, CLV to SGND ..............-0.3V to +30V
SENSE+ to LV........................................................-0.3V to +0.3V
HV, IN to LV ............................................................-0.3V to +30V
OVP+, CLV, DIMOUT to LV ......................................-0.3V to +6V
PGND to SGND .....................................................-0.3V to +0.3V
V
NDRV to PGND...........................................-0.3V to (V
All Other Pins to SGND.............................................-0.3V to +6V
NDRV Continuous Current................................................±50mA
DIMOUT Continuous Current..............................................±2mA
V
Continuous Power Dissipation (T
ELECTRICAL CHARACTERISTICS
(V
R
Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
2
Input Voltage Range
Quiescent Supply Current
Shutdown Supply Current
INTERNAL LINEAR REGULATOR (V
Output Voltage
Dropout Voltage
Short-Circuit Current
LINEAR REGULATOR (CLV)
Output Voltage
Dropout Voltage
Short-Circuit Current
REFERENCE VOLTAGE (REF)
Output Voltage
REF Short-Circuit Current
UNDERVOLTAGE LOCKOUT/ENABLE INPUT (UVEN)
UVEN On Threshold Voltage
UVEN Threshold Voltage
Hysteresis
Input Leakage Current
PWMDIM
PWMDIM On Threshold Voltage
PWMDIM Threshold Voltage
Hysteresis
CC
CC
RT
20-Pin TQFN (4mm x 4mm)
(derate 25.6mW/°C* above +70°C) ............................2051mW
IN
_______________________________________________________________________________________
= 10kΩ, T
to SGND..........................................................-0.3V to +12V
Short-Circuit Current to SGND Duration ...........................1s
= V
layer board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial.
HV
PARAMETER
= 12V, V
A
= T
J
= -40°C to +125°C, unless otherwise noted. Typical values are at T
UVEN
= 5V, V
A
= +70°C)
LV
V
(V
UVEN_THUP
SYMBOL
V
CC
CLV -
PWMDIM
= V
I
I
V
SHDN
V
V
LEAK
V
V
)
I
REF
DO
DO
CC
Q
IN
PWMDIM
V
LV
)
Excluding I
V
0 ≤ I
I
V
0 ≤ I
6V ≤ V
I
V
0 ≤ I
V
V
CC
CLV
UVEN
CC
CLV
REF
UVEN
CC
= V
= 35mA (Note 2)
CC
CLV
REF
= 0, V
+ 0.3V)
= 2mA, 0 ≤ V
= 12V, V
= 0
SGND
(HV-LV)
= 0
= 0
≤ 50mA, 9.5V ≤ V
≤ 1mA, 4.75V ≤ V
≤ 2mA, 6V ≤ V
IN
LED
, C
= 12V
≤ 22V
IN
CONDITIONS
VCC
= 12V, V
LV
Junction-to-Ambient Thermal Resistance (
Junction-to-Case Thermal Resistance (
Operating Temperature Range .........................-40°C to +125°C
Junction Temperature ......................................................+150°C
Storage Temperature Range .............................-65°C to +150°C
Lead Temperature (soldering, 10s) .................................+300°C
* As per JEDEC51 standard (multilayer board).
= 4.7μF, C
20-Pin TSSOP (derate 26.5mW/°C above +70°C) ..........2122mW
20-Pin TQFN 4mm x 4mm .................................................39°C/W
20-Pin TSSOP..................................................................37.7°C/W
20-Pin TQFN 4mm x 4mm ...............................................6°C/W
20-Pin TSSOP..................................................................2°C/W
≤ 23.3V (Note 3)
HV
IN
HV
IN
≤ 28V,
≤ 28V
≤ 28V
= 24V
LCV
= 100nF, C
A
= +25°C.)
3.625
1.395
1.395
4.75
MIN
6.3
4.7
2.2
80
REF
= 100nF, R
1.435
1.435
TYP
0.65
3.70
200
200
30
30
θ
6
7
5
1
JC
θ
JA
) (Note 1)
) (Note 1)
3.775
1.475
1.475
MAX
SENSE+
300
7.7
5.3
0.5
28
10
60
10
1
UNITS
= 0.1Ω,
mA
mA
mA
mA
mV
mV
μA
μA
V
V
V
V
V
V
V
V