FAN5646UC00X Fairchild Semiconductor, FAN5646UC00X Datasheet - Page 2

IC LED DRIVER BLINKER 4WLCSP

FAN5646UC00X

Manufacturer Part Number
FAN5646UC00X
Description
IC LED DRIVER BLINKER 4WLCSP
Manufacturer
Fairchild Semiconductor
Series
TinyWire™r
Type
LED Blinkerr
Datasheet

Specifications of FAN5646UC00X

Constant Current
Yes
Topology
High Side
Number Of Outputs
1
Internal Driver
Yes
Type - Primary
LED Blinker
Voltage - Supply
2.7 V ~ 5.5 V
Mounting Type
Surface Mount
Package / Case
4-WLCSP
Operating Temperature
-40°C ~ 85°C
Current - Output / Channel
20mA
Operating Supply Voltage
2.7 V to 5.5 V
Maximum Supply Current
20 mA
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
Minimum Operating Temperature
- 40 C
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Voltage - Output
-
Frequency
-
Internal Switch(s)
-
Efficiency
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
FAN5646UC00XTR

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
FAN5646UC00X
Manufacturer:
FSC
Quantity:
3 000
Part Number:
FAN5646UC00X
Manufacturer:
FAIRCHILD/仙童
Quantity:
20 000
© 2009 Fairchild Semiconductor Corporation
FAN5646 • Rev. 1.0.2
Physical Dimensions
Product-Specific Dimensions
Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner without
notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or obtain the most
recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions, specifically the warranty therein, which
covers Fairchild products.
Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings:
http://www.fairchildsemi.com/packaging/.
INDEX AREA
FAN5646UC
Product
BALL A1
2X
0.05 C
0.03 C
0.40
C
0.40
BOTTOM VIEW
TOP VIEW
1 2
E
SEATING PLANE
B
A
0.820mm
(X)±0.018
A
0.625
0.547
Ø0.260±0.020
4X
D
D
B
D
2X
0.06 C
(Y)±0.018
F
0.005
Figure 15. 4-Bump WLCSP, 0.4mm Pitch
0.03 C
F
E
C A B
SIDE VIEWS
0.820mm
NOTES:
11
E X Y
D. DATUM C IS DEFINED BY THE SPHERICAL
E. PACKAGE NOMINAL HEIGHT IS 586 MICRONS
F. FOR DIMENSIONS D, E, X, AND Y SEE
B. DIMENSIONS ARE IN MILLIMETERS.
C. DIMENSIONS AND TOLERANCE
G. DRAWING FILNAME: MKT-UC004ACrev2.
A. NO JEDEC REGISTRATION APPLIES.
±39 MICRONS (547-625 MICRONS).
PER ASME Y14.5M, 1994.
CROWNS OF THE BALLS.
PRODUCT DATASHEET.
RECOMMENDED LAND PATTERN
(NSMD PAD TYPE)
0.40
0.40
A1
0.210mm
0.378±0.018
0.208±0.021
Ø0.30
Solder Mask
Ø0.20
Cu Pad
www.fairchildsemi.com
0.210mm

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