CY7C1381D-133BGXC Cypress Semiconductor Corp, CY7C1381D-133BGXC Datasheet - Page 25
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CY7C1381D-133BGXC
Manufacturer Part Number
CY7C1381D-133BGXC
Description
IC SRAM 18MBIT 133MHZ 165LFBGA
Manufacturer
Cypress Semiconductor Corp
Datasheet
1.CY7C1381D-133BGXC.pdf
(29 pages)
Specifications of CY7C1381D-133BGXC
Format - Memory
RAM
Memory Type
SRAM - Synchronous
Memory Size
18M (512K x 36)
Speed
133MHz
Interface
Parallel
Voltage - Supply
3.135 V ~ 3.6 V
Operating Temperature
0°C ~ 70°C
Package / Case
165-LFBGA
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
CY7C1381D-133BGXC
Manufacturer:
Cypress Semiconductor Corp
Quantity:
10 000
Document #: 38-05544 Rev. *A
Timing Diagrams
ZZ Mode Timing
Ordering Information
Notes:
29. Device must be deselected when entering ZZ mode. See Cycle Descriptions table for all possible signal conditions to deselect the device.
30. DQs are in high-Z when exiting ZZ sleep mode.
Speed
(MHz)
133
100
CY7C1381D-133AXC
CY7C1383D-133AXC
CY7C1381D-133BGC
CY7C1383D-133BGC
CY7C1381D-133BZC
CY7C1383D-133BZC
CY7C1381D-133BGXC
CY7C1383D-133BGXC
CY7C1381D-133BZXC
CY7C1383D-133BZXC
CY7C1381D-100AXC
CY7C1383D-100AXC
CY7C1381D-100BGC
CY7C1383D-100BGC
CY7C1381D-100BZC
CY7C1383D-100BZC
CY7C1381D-100BGXC
CY7C1383D-100BGXC
CY7C1381D-100BZXC
CY7C1383D-100BZXC
ALL INPUTS
(except ZZ)
Outputs (Q)
Ordering Code
I
[29, 30]
SUPPLY
CLK
ZZ
(continued)
Package
t ZZI
BB165D 165-ball Fine-Pitch Ball Grid Array (13 x 15 x 1.4mm)
BB165D Lead-Free 165-ball Fine-Pitch Ball Grid Array (13 x 15 x
BB165D 165-ball Fine-Pitch Ball Grid Array (13 x 15 x 1.4mm)
BB165D Lead-Free 165-ball Fine-Pitch Ball Grid Array (13 x 15 x
BG119
BG119
BG119
BG119
Name
t ZZ
I DDZZ
A101
A101
Lead-Free 100-lead Thin Quad Flat Pack (14 x 20 x 1.4mm) 3
Chip Enables
119-ball (14 x 22 x 2.4 mm) BGA 3 Chip Enables and JTAG
3 Chip Enables and JTAG
Lead-Free 119-ball (14 x 22 x 2.4 mm) BGA 3 Chip Enables
and JTAG
1.4mm) 3 Chip Enables and JTAG
Lead-Free 100-lead Thin Quad Flat Pack (14 x 20 x 1.4mm) 3
Chip Enables
119-ball (14 x 22 x 2.4 mm) BGA 3 Chip Enables and JTAG
3 Chip Enables and JTAG
Lead-Free 119-ball (14 x 22 x 2.4 mm) BGA 3 Chip Enables
and JTAG
1.4mm) 3 Chip Enables and JTAG
PRELIMINARY
DON’T CARE
High-Z
Part and Package Type
DESELECT or READ Only
t RZZI
t
ZZREC
CY7C1381D
CY7C1383D
Page 25 of 29
Commercial
Commercial
Operating
Range