MT46H8M16LFCF-75 Micron Technology Inc, MT46H8M16LFCF-75 Datasheet - Page 66

• Manufacturer Part Number: MT46H8M16LFCF-75
• Description: IC DDR SDRAM 128MBIT 60VFBGA
• Manufacturer: Micron Technology Inc

Specifications of MT46H8M16LFCF-75

• Format - Memory: RAM
• Memory Type: Mobile DDR SDRAM
• Memory Size: 128M (8Mx16)
• Speed: 133MHz
• Interface: Parallel
• Voltage - Supply: 1.7 V ~ 1.9 V
• Operating Temperature: 0°C ~ 70°C
• Package / Case: 60-VFBGA
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

Package Dimensions
Figure 43:
PDF: 09005aef8199c1ec/Source: 09005aef81a19319
MT46H8M16LF_1.fm - Rev. K 7/07 EN
Micron, the M logo, and the Micron logo are trademarks of Micron Technology, Inc. All other trademarks are the property of
This data sheet contains minimum and maximum limits specified over the power supply and temperature range set forth
SOLDER BALL
DIAMETER REFERS
TO POST REFLOW
CONDITION. THE PRE-
REFLOW DIAMETER
IS Ø 0.42
herin. Although considered final, these specifications are subject to change, as further product development and data
60X Ø 0.45
SEATING
7.20
PLANE
0.10 C
BALL A9
60-Ball VFBGA Package
3.60
Notes:
[e-mail] www.micron.com Customer Comment Line: 800-932-4992
C
8000 S. Federal Way, P.O. Box 6, Boise, ID 83707-0006, Tel: [phone]
1. Dimensions are in millimeters.
3.20
0.80 TYP
8.00 ±0.10
6.40
C L
4.00 ±0.05
characterization sometimes occur.
C L
their respective owners.
0.80 TYP
BALL A1
0.65 ±0.05
BALL A1 ID
5.00 ±0.05
66
10.00 ±0.10
®
128Mb: 8 Meg x 16 Mobile DDR SDRAM
Micron Technology, Inc., reserves the right to change products or specifications without notice.
1.00 MAX
SOLDER BALL MATERIAL:
SOLDER BALL PADS:
SUBSTRATE MATERIAL:
MOLD COMPOUND:
PLASTIC LAMINATE
EPOXY NOVOLAC
96.5% Sn, 3% Ag, 0.5% Cu (lead-free)
Ø 0.40 SOLDER MASK DEFINED
Package Dimensions
©2004 Micron Technology, Inc. All rights reserved.
BALL A1 ID