MAX5825PMB1# Maxim Integrated, MAX5825PMB1# Datasheet - Page 2

• Manufacturer Part Number: MAX5825PMB1#
• Description: Data Conversion IC Development Tools MAX5825 Peripheral Module
• Manufacturer: Maxim Integrated
• Type: DACr
• Series: MAX5823, MAX5824, MAX5825r

Specifications of MAX5825PMB1#

• Rohs: yes
• Product: Peripheral Module
• Tool Is For Evaluation Of: MAX5825
• Interface Type: I2C
• Operating Supply Voltage: 2.048 V, 2.5 V, 4.096 V
• Description/function: Peripheral module provides the necessary hardware to interface the MAX5825 8-channel DAC to any system that utilizes Pmod-compatible expansion ports configurable for IýC communication
• Maximum Operating Temperature: + 125 C
• Minimum Operating Temperature: - 40 C
• Part # Aliases: 90-58250#PM1
• For Use With: MAX5285 8-Channel DAC

ABSOLUTE MAXIMUM RATINGS
V
OUT_, REF to GND ....0.3V to the lower of (V
SCL, SDA, IRQ, M/Z, LDAC, CLR to GND .............-0.3V to +6V
ADDR_ to GND ............................................-0.3V to the lower of
Continuous Power Dissipation (T
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional opera-
tion of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
PACkAGE THERMAL CHARACTERISTICS (Note 1)
TSSOP
Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer
Note 2: Visit
ELECTRICAL CHARACTERISTICS
(V
(Note 3)
Maxim Integrated
Output DACs with Internal Reference and I
DC PERFORMANCE (Note 4)
Resolution and Monotonicity
Integral Nonlinearity (Note 5)
Differential Nonlinearity (Note 5)
Offset Error (Note 6)
Offset Error Drift
Gain Error (Note 6)
Gain Temperature Coefficient
Zero-Scale Error
Full-Scale Error
DD
DD
TSSOP (derate at 13.6mW/NC above 70NC) ..............1084mW
WLP (derate at 21.3mW/NC above 70NC) ..................1700mW
Junction-to-Ambient Thermal Resistance (θ
Junction-to-Case Thermal Resistance (θ
, V
= 2.7V to 5.5V, V
DDIO
board. For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal-tutorial.
aging.
PARAMETER
to GND ................................................-0.3V to +6V
www.maximintegrated.com/app-notes/index.mvp/id/1891
Ultra-Small, Octal Channel, 8-/10-/12-Bit Buffered
DDIO
= 1.8V to 5.5V, V
A
= +70NC)
SYMBOL
(V
DNL
INL
OE
GE
DDIO
N
JC
DD
) ..............20NC/W
JA
+ 0.3V) and +6V
GND
+ 0.3V) and +6V
) ......73.8NC/W
MAX5823
MAX5824
MAX5825
MAX5823
MAX5824
MAX5825
MAX5823
MAX5824
MAX5825
With respect to V
With respect to V
= 0V, C
MAX5823/MAX5824/MAX5825
L
= 200pF, R
CONDITIONS
REF
REF
Maximum Continuous Current into Any Pin .................... Q50mA
Operating Temperature .................................... -40NC to +125NC
Storage Temperature ....................................... -65NC to +150NC
Lead Temperature (TSSOP only)(soldering, 10s) ...........+300NC
Soldering Temperature (reflow) .................................... +260NC
WLP
Junction-to-Ambient Thermal Resistance (θ
for information about the thermal performance of WLP pack-
L
(Note 2) ...................................................................47NC/W
= 2kI, T
A
= -40NC to +125NC, unless otherwise noted.)
-0.25
-0.25
MIN
-0.5
-0.5
-1.0
-0.5
10
12
-1
-1
-5
8
0
2
C Interface
Q0.05
Q0.05
Q0.2
Q0.5
Q0.1
Q0.2
Q0.5
Q0.1
Q3.0
TYP
Q10
JA
+10
+0.5
+0.25
+0.25
MAX
+0.5
+0.5
+1.0
)
+1
+1
+5
ppm of
UNITS
FV/NC
FS/NC
%FS
%FS
LSB
LSB
Bits
mV
mV
2