CY7C1383D-133AXC Cypress Semiconductor Corp, CY7C1383D-133AXC Datasheet - Page 28

• Manufacturer Part Number: CY7C1383D-133AXC
• Description: IC SRAM 18MBIT 133MHZ 100LQFP
• Manufacturer: Cypress Semiconductor Corp

Specifications of CY7C1383D-133AXC

• Memory Size: 18M (1M x 18)
• Format - Memory: RAM
• Memory Type: SRAM - Synchronous
• Speed: 133MHz
• Interface: Parallel
• Voltage - Supply: 3.135 V ~ 3.6 V
• Operating Temperature: 0°C ~ 70°C
• Package / Case: 100-LQFP
• Memory Configuration: 1M X 18 / 512K X 36
• Clock Frequency: 133MHz
• Access Time: 6.5ns
• Supply Voltage Range: 3.135V To 3.6V
• Memory Case Style: TQFP
• No. Of Pins: 100
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: 428-1848

Package Diagrams
Intel and Pentium are registered trademarks, and i486 is a trademark of Intel Corporation. All product and company names
mentioned in this document are the trademarks of their respective holders.
Document #: 38-05544 Rev. *F
© Cypress Semiconductor Corporation, 2006-2007. The information contained herein is subject to change without notice. Cypress Semiconductor Corporation assumes no responsibility for
the use of any circuitry other than circuitry embodied in a Cypress product. Nor does it convey or imply any license under patent or other rights. Cypress products are not warranted nor intended
to be used for medical, life support, life saving, critical control or safety applications, unless pursuant to an express written agreement with Cypress. Furthermore, Cypress does not authorize
its products for use as critical components in life-support systems where a malfunction or failure may reasonably be expected to result in significant injury to the user. The inclusion of Cypress
products in life-support systems application implies that the manufacturer assumes all risk of such use and in doing so indemnifies Cypress against all charges.
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PIN 1 CORNER
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SEATING PLANE
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PIN 1 CORNER
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SEATING PLANE
(continued)
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13.00±0.10
TOP VIEW
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TOP VIEW
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Figure 3. 165-ball FBGA (13 x 15 x 1.4 mm) (51-85180)
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165 FBGA 13 x 15 x 1.40 MM BB165D/BW165D
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JEDEC REFERENCE : MO-216 / DESIGN 4.6C
PACKAGE WEIGHT : 0.475g
PACKAGE CODE : BB0AC
SOLDER PAD TYPE : NON-SOLDER MASK DEFINED (NSMD)
NOTES :
B
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JEDEC REFERENCE : MO-216 / DESIGN 4.6C
SOLDER PAD TYPE : NON-SOLDER MASK DEFINED (NSMD)
PACKAGE WEIGHT : 0.475g
PACKAGE CODE : BB0AC
NOTES :
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CY7C1381D, CY7C1381F
CY7C1383D, CY7C1383F
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BOTTOM VIEW
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BOTTOM VIEW
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Ø0.50 (165X)
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Ø0.05 M C
Ø0.25 M C A B
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51-85180-*A
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+0.14
Ø0.50
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Ø0.05 M C
Ø0.25 M C A B
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PIN 1 CORNER
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51-85180-*A
PIN 1 CORNER
(165X)
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