CY62158EV30LL-45ZSXI Cypress Semiconductor Corp, CY62158EV30LL-45ZSXI Datasheet - Page 7

IC SRAM 8MBIT 45NS 44TSOP

CY62158EV30LL-45ZSXI

Manufacturer Part Number
CY62158EV30LL-45ZSXI
Description
IC SRAM 8MBIT 45NS 44TSOP
Manufacturer
Cypress Semiconductor Corp
Type
Asynchronousr

Specifications of CY62158EV30LL-45ZSXI

Memory Size
8M (1M x 8)
Package / Case
44-TSOP II
Format - Memory
RAM
Memory Type
SRAM
Speed
45ns
Interface
Parallel
Voltage - Supply
2.2 V ~ 3.6 V
Operating Temperature
-40°C ~ 85°C
Access Time
45 ns
Supply Voltage (max)
3.6 V
Supply Voltage (min)
2.2 V
Maximum Operating Current
25 mA
Maximum Operating Temperature
+ 85 C
Minimum Operating Temperature
- 40 C
Mounting Style
SMD/SMT
Number Of Ports
1
Operating Supply Voltage
2.5 V, 3.3 V
Memory Configuration
1M X 8
Supply Voltage Range
2.2V To 3.6V
Memory Case Style
TSOP
No. Of Pins
44
Operating Temperature Range
-40°C To +85°C
Rohs Compliant
Yes
Density
8Mb
Access Time (max)
45ns
Sync/async
Asynchronous
Architecture
Not Required
Clock Freq (max)
Not RequiredMHz
Operating Supply Voltage (typ)
2.5/3.3V
Address Bus
20b
Package Type
TSOP-II
Operating Temp Range
-40C to 85C
Supply Current
25mA
Operating Supply Voltage (min)
2.2V
Operating Supply Voltage (max)
3.6V
Operating Temperature Classification
Industrial
Mounting
Surface Mount
Pin Count
44
Word Size
8b
Number Of Words
1M
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant
Other names
428-2081
CY62158EV30LL-45ZSXI

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
CY62158EV30LL-45ZSXI
Manufacturer:
CYPRESS
Quantity:
60
Part Number:
CY62158EV30LL-45ZSXI
Manufacturer:
CYPRESS/赛普拉斯
Quantity:
20 000
Switching Characteristics
Over the Operating Range
Document #: 38-05578 Rev. *G
Notes
Parameter
Read Cycle
t
t
t
t
t
t
t
t
t
t
t
Write Cycle
t
t
t
t
t
t
t
t
t
t
13. Test conditions for all parameters other than tri-state parameters assume signal transition time of 3 ns or less (1V/ns), timing reference levels of V
14. At any given temperature and voltage condition, t
15. t
16. The internal write time of the memory is defined by the overlap of WE, CE
RC
AA
OHA
ACE
DOE
LZOE
HZOE
LZCE
HZCE
PU
PD
WC
SCE
AW
HA
SA
PWE
SD
HD
HZWE
LZWE
levels of 0 to V
signals can terminate a write by going INACTIVE. The data input setup and hold timing should be referenced to the edge of the signal that terminates the write.
HZOE
, t
HZCE
[13]
[16]
, and t
CC(typ)
Read Cycle Time
Address to Data Valid
Data Hold from Address Change
CE
OE LOW to Data Valid
OE LOW to Low Z
OE HIGH to High Z
CE
CE
CE
CE
Write Cycle Time
CE
Address Setup to Write End
Address Hold from Write End
Address Setup to Write Start
WE Pulse Width
Data Setup to Write End
Data Hold from Write End
WE LOW to High Z
WE HIGH to Low Z
HZWE
1
1
1
1
1
1
, and output loading of the specified I
LOW and CE
LOW and CE
HIGH or CE
LOW and CE
HIGH or CE
LOW and CE
transitions are measured when the outputs enter a high impedance state.
2
2
2
2
2
2
LOW to High Z
LOW to Power Down
[14]
[14, 15]
[14]
[14, 15]
HIGH to Data Valid
HIGH to Low Z
HIGH to Power Up
HIGH to Write End
HZCE
is less than t
[14, 15]
OL
[14]
/I
Description
OH
as shown in
LZCE
, t
HZOE
1
= V
AC Test Loads and Waveforms on page
IL
is less than t
, and CE
2
= V
LZOE
IH
. All signals must be ACTIVE to initiate a write and any of these
, and t
HZWE
is less than t
CY62158EV30 MoBL
5.
LZWE
for any given device.
Min
45
10
10
45
35
35
35
25
10
5
0
0
0
0
45 ns
CC(typ)
Max
45
45
22
18
18
45
18
Page 7 of 16
/2, input pulse
Unit
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
®
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