C8051F347-GMR Silicon Labs, C8051F347-GMR Datasheet - Page 36
C8051F347-GMR
Manufacturer Part Number
C8051F347-GMR
Description
8-bit Microcontrollers - MCU 25 MIPS 32KB 10 ADC
Manufacturer
Silicon Labs
Datasheet
1.C8051F349-GMR.pdf
(276 pages)
Specifications of C8051F347-GMR
Rohs
yes
Core
8051
Data Bus Width
8 bit
Processor Series
C8051
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C8051F340/1/2/3/4/5/6/7/8/9/A/B/C/D
36
Notes:
General:
Solder Mask Design:
Stencil Design:
Card Assembly:
1. All dimensions shown are in millimeters (mm) unless otherwise noted.
2. This Land Pattern Design is based on the IPC-7351 guidelines.
3. All metal pads are to be non-solder mask defined (NSMD). Clearance between
4. A stainless steel, laser-cut and electro-polished stencil with trapezoidal walls
5. The stencil thickness should be 0.125 mm (5 mils).
6. The ratio of stencil aperture to land pad size should be 1:1 for all pads.
7. A No-Clean, Type-3 solder paste is recommended.
8. The recommended card reflow profile is per the JEDEC/IPC J-STD-020
Figure 4.6. LQFP-32 Recommended PCB Land Pattern
the solder mask and the metal pad is to be 60 µm minimum, all the way around
the pad.
should be used to assure good solder paste release.
specification for Small Body Components.
Table 4.5. LQFP-32 PCB Land Pattern Dimensions
Dimension
C1
C2
X1
Y1
E
Rev. 1.3
8.40
8.40
0.40
1.25
Min
0.80 BSC
Max
8.50
8.50
0.50
1.35
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