C8051F545-IQR Silicon Labs, C8051F545-IQR Datasheet - Page 28
![no-image](/images/no-image-200.jpg)
C8051F545-IQR
Manufacturer Part Number
C8051F545-IQR
Description
8-bit Microcontrollers - MCU 50 MIPS 8 kB 1 kB SPI UART I2C
Manufacturer
Silicon Labs
Datasheet
1.C8051F546-IMR.pdf
(274 pages)
Specifications of C8051F545-IQR
Rohs
yes
Core
8051
Data Bus Width
8 bit
Processor Series
C8051
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
C8051F545-IQR
Manufacturer:
Silicon Laboratories Inc
Quantity:
10 000
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C8051F54x
28
Notes:
General
Solder Mask Design
Stencil Design
Card Assembly
1. All dimensions shown are in millimeters (mm) unless otherwise noted.
2. This Land Pattern Design is based on the IPC-7351 guidelines.
3. All metal pads are to be non-solder mask defined (NSMD). Clearance between the solder mask and the
4. A stainless steel, laser-cut and electro-polished stencil with trapezoidal walls should be used to assure
5. The stencil thickness should be 0.125 mm (5 mils).
6. The ratio of stencil aperture to land pad size should be 1:1 for all perimeter pads.
7. A 2x2 array of 1.10 mm x 1.10 mm openings on a 1.30 mm pitch should be used for the center ground
8. A No-Clean, Type-3 solder paste is recommended.
9. The recommended card reflow profile is per the JEDEC/IPC J-STD-020 specification for Small Body
Dimension
metal pad is to be 60 m minimum, all the way around the pad.
good solder paste release.
pad.
Components.
C1
C2
X1
E
Table 4.6. QFN-24 Landing Diagram Dimensions
3.90
3.90
0.20
Min
Figure 4.6. QFN-24 Landing Diagram
0.50 BSC
Max
4.00
4.00
0.30
Rev. 1.1
Dimension
X2
Y1
Y2
2.70
0.65
2.70
Min
Max
2.80
0.75
2.80
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