AT93C56A-10SU-2.7 Atmel, AT93C56A-10SU-2.7 Datasheet - Page 20

• Manufacturer Part Number: AT93C56A-10SU-2.7
• Description: IC EEPROM 2KBIT 2MHZ 8SOIC
• Manufacturer: Atmel

Specifications of AT93C56A-10SU-2.7

• Format - Memory: EEPROMs - Serial
• Memory Type: EEPROM
• Memory Size: 2K (256 x 8 or 128 x 16)
• Speed: 1MHz, 2MHz
• Interface: 3-Wire Serial
• Voltage - Supply: 2.7 V ~ 5.5 V
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 8-SOIC (3.9mm Width)
• Organization: 256 x 8 or 128 K x 16
• Interface Type: 3-Wire
• Maximum Clock Frequency: 1 MHz
• Supply Voltage (max): 5.5 V
• Supply Voltage (min): 2.7 V
• Maximum Operating Current: 2 mA
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• Minimum Operating Temperature: - 40 C
• Operating Supply Voltage: 3.3 V, 5 V
• Capacitance, Input: 5 pF
• Capacitance, Output: 5 pF
• Current, Input, Leakage: 0.1 μA
• Current, Operating: 0.5 mA
• Current, Output, Leakage: 0.1
• Data Retention: 100 yrs.
• Density: 2K
• Package Type: JEDEC SOIC
• Temperature, Operating: -40 to +85 °C
• Time, Address Setup: 50
• Time, Fall: 250 ns
• Time, Rise: 250 ns
• Voltage, Input, High: 3.7 to 6.5 V
• Voltage, Input, Low: 0.8 V
• Voltage, Output, High: 2.4 V
• Voltage, Output, Low: 0.4 V
• Voltage, Supply: 2.7 to 5.5 V
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

8.7
20
8U3-1 – dBGA2
(e1)
1. This drawing is for general information only.
2. Dimension ‘b’ is measured at maximum solder ball diameter
(d1)
R
AT93C56A/66A
d
1150E Cheyenne Mt. Blvd
Colorado Springs, CO 80906
1
8
PIN 1 BALL PAD CORNER
PIN 1 BALL PAD CORNER
e
Bottom View
2
7
Top View
8 Solder Balls
E
3
6
TITLE
8U3-1, 8-ball, 1.50 x 2.00 mm Body, 0.50 mm pitch,
Small Die Ball Grid Array Package (dBGA2)
4
5
D
A
2
SYMBOL
A
A1
A2
b
D
E
e
e1
d
d1
Side View
MIN
A
0.713
0.09
0.40
0.20
COMMON DIMENSIONS
(Unit of Measure = mm)
1.50 BSC
2.00 BSC
0.50 BSC
1.00 BSC
0.25 REF
0.25 REF
NOM
0.79
0.14
0.45
0.25
DRAWING NO.
A
1
PO8U3-1
MAX
0.85
0.19
0.50
0.30
1.
b
NOTE
2
5/3/05
REV.
b
3378O–SEEPR–11/09