AT93C56A-10SU-2.7 Atmel, AT93C56A-10SU-2.7 Datasheet - Page 17

• Manufacturer Part Number: AT93C56A-10SU-2.7
• Description: IC EEPROM 2KBIT 2MHZ 8SOIC
• Manufacturer: Atmel

Specifications of AT93C56A-10SU-2.7

• Format - Memory: EEPROMs - Serial
• Memory Type: EEPROM
• Memory Size: 2K (256 x 8 or 128 x 16)
• Speed: 1MHz, 2MHz
• Interface: 3-Wire Serial
• Voltage - Supply: 2.7 V ~ 5.5 V
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 8-SOIC (3.9mm Width)
• Organization: 256 x 8 or 128 K x 16
• Interface Type: 3-Wire
• Maximum Clock Frequency: 1 MHz
• Supply Voltage (max): 5.5 V
• Supply Voltage (min): 2.7 V
• Maximum Operating Current: 2 mA
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• Minimum Operating Temperature: - 40 C
• Operating Supply Voltage: 3.3 V, 5 V
• Capacitance, Input: 5 pF
• Capacitance, Output: 5 pF
• Current, Input, Leakage: 0.1 μA
• Current, Operating: 0.5 mA
• Current, Output, Leakage: 0.1
• Data Retention: 100 yrs.
• Density: 2K
• Package Type: JEDEC SOIC
• Temperature, Operating: -40 to +85 °C
• Time, Address Setup: 50
• Time, Fall: 250 ns
• Time, Rise: 250 ns
• Voltage, Input, High: 3.7 to 6.5 V
• Voltage, Input, Low: 0.8 V
• Voltage, Output, High: 2.4 V
• Voltage, Output, Low: 0.4 V
• Voltage, Supply: 2.7 to 5.5 V
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

8.4
3378O–SEEPR–11/09
Notes:
8Y6 – MiniMap (MLP 2x3)
3. Soldering the large thermal pad is optional, but not recommended. No electrical connection is accomplished to the
1. This drawing is for general information only. Refer to JEDEC Drawing MO-229, for proper dimensions,
2. Dimension b applies to metallized terminal and is measured between 0.15 mm and 0.30 mm from the terminal tip. If the
Package Drawing Contact:
[e-mail]
tolerances, datums, etc.
terminal has the optional radius on the other end of the terminal, the dimension should not be measured in that radius area.
device through this pad, so if soldered it should be tied to ground
D
Pin 1
Pin 1
Index
Index
Area
Area
TITLE
8Y6, 8-lead 2.0x3.0 mm Body, 0.50 mm Pitch,
UltraThin Mini-MAP, Dual No Lead Package
(Sawn)(UDFN)
A3
A3
A2
A2
A
A1
A1
SYMBOL
E2
A
A3
e
D
E
D2
A1
A2
L
b
1.40
0.20
0.20
COMMON DIMENSIONS
MIN
0.0
(Unit of Measure = mm)
-
-
-
1.50 REF.
1.50 REF.
e (6X)
e (6X)
D2 D2
2.00 BSC
3.00 BSC
0.20 REF
0.50 BSC
NOM
1.50
0.02
0.30
0.25
-
-
-
GPC
YNZ
AT93C56A/66A
MAX
1.60
1.40
0.60
0.05
0.55
0.40
0.30
DRAWING NO.
NOTE
(8X)
(8X)
2
8Y6
Pin 1 ID
Pin 1 ID
b
L (8X)
L (8X)
11/21/08
REV.
E
17