AT93C56A-10SU-2.7 Atmel, AT93C56A-10SU-2.7 Datasheet - Page 12

• Manufacturer Part Number: AT93C56A-10SU-2.7
• Description: IC EEPROM 2KBIT 2MHZ 8SOIC
• Manufacturer: Atmel

Specifications of AT93C56A-10SU-2.7

• Format - Memory: EEPROMs - Serial
• Memory Type: EEPROM
• Memory Size: 2K (256 x 8 or 128 x 16)
• Speed: 1MHz, 2MHz
• Interface: 3-Wire Serial
• Voltage - Supply: 2.7 V ~ 5.5 V
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 8-SOIC (3.9mm Width)
• Organization: 256 x 8 or 128 K x 16
• Interface Type: 3-Wire
• Maximum Clock Frequency: 1 MHz
• Supply Voltage (max): 5.5 V
• Supply Voltage (min): 2.7 V
• Maximum Operating Current: 2 mA
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• Minimum Operating Temperature: - 40 C
• Operating Supply Voltage: 3.3 V, 5 V
• Capacitance, Input: 5 pF
• Capacitance, Output: 5 pF
• Current, Input, Leakage: 0.1 μA
• Current, Operating: 0.5 mA
• Current, Output, Leakage: 0.1
• Data Retention: 100 yrs.
• Density: 2K
• Package Type: JEDEC SOIC
• Temperature, Operating: -40 to +85 °C
• Time, Address Setup: 50
• Time, Fall: 250 ns
• Time, Rise: 250 ns
• Voltage, Input, High: 3.7 to 6.5 V
• Voltage, Input, Low: 0.8 V
• Voltage, Output, High: 2.4 V
• Voltage, Output, Low: 0.4 V
• Voltage, Supply: 2.7 to 5.5 V
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

6. AT93C56A Ordering Information
Notes:
12
Ordering Code
AT93C56A-10PU-2.7
AT93C56A-10PU-1.8
AT93C56A-10SU-2.7
AT93C56A-10SU-1.8
AT93C56AW-10SU-2.7
AT93C56AW-10SU-1.8
AT93C56A-10TU-2.7
AT93C56A-10TU-1.8
AT93C56AU3-10UU-1.8
AT93C56AD3-10DH-1.8
AT93C56AY1-10YU-1.8
AT93C56AY6-10YH-1.8
AT93C56A-W1.8-11
8P3
8S1
8S2
8A2
8U3-1
8Y1
8Y6
8D3
−2.7
−1.8
1. For 2.7V devices used in the 4.5V to 5.5V range, please refer to performance values in the AC and DC characteristics table.
2. “U” designates Green package + RoHS compliant.
3. “H” designates Green package + RoHS compliant, with NiPdAu Lead Finish.
4. Available in waffle pack and wafer form; order as SL788 for inkless wafer form. Bumped die available upon request. Please
AT93C56A/66A
contact Serial Marketing.
8-lead, 0.300" Wide, Plastic Dual Inline Package (PDIP)
8-lead, 0.150" Wide, Plastic Gull Wing Small Outline (JEDEC SOIC)
8-lead, 0.200" Wide, Plastic Gull Wing Small Outline (EIAJ SOIC)
8-lead, 0.170" Wide, Thin Shrink Small Outline Package (TSSOP)
8-ball, die Ball Grid Array Package (dBGA2)
8-lead, 4.90 mm x 3.00 mm Body, Dual Footprint, Non-leaded, Miniature Array Package (MAP)
8-lead, 2.00 mm x 3.00 mm Body, 0.50 mm Pitch, Ultra Thin Mini-MAP, Dual No Lead package (DFN), (MLP 2x3 mm)
8-lead, 1.80 mm x 2.20 mm Body, Ultra Lead Frame Land Grid Array (ULA)
Low-voltage (2.7V to 5.5V)
Low-voltage (1.8V to 5.5V)
(4)
(2)
(2)
(2)
(2)
(2)
(2)
(2)
(2)
(2)
(3)
(2)
(3)
(Not recommended for new design)
(1)
Package Type
Options
Die Sales
Package
8U3-1
8P3
8P3
8S1
8S1
8S2
8S2
8A2
8A2
8D3
8Y1
8Y6
Lead-free/Halogen-free/
Industrial Temperature
Industrial Temperature
Operation Range
(−40°C to 85°C)
(−40°C to 85°C)
3378O–SEEPR–11/09