MAX5715AAUD+ Maxim Integrated, MAX5715AAUD+ Datasheet - Page 2

• Manufacturer Part Number: MAX5715AAUD+
• Description: Digital to Analog Converters - DAC 12Bit 4CH V Buff Precision ADC
• Manufacturer: Maxim Integrated

Specifications of MAX5715AAUD+

• Rohs: yes
• Number Of Converters: 4
• Number Of Dac Outputs: 4
• Resolution: 12 bit
• Interface Type: SPI, Serial (3-Wire, Microwire)
• Settling Time: 4.5 us
• Maximum Operating Temperature: + 125 C
• Mounting Style: SMD/SMT
• Package / Case: TSSOP-14
• Maximum Power Dissipation: 797 mW
• Minimum Operating Temperature: - 40 C
• Output Type: Voltage Buffered
• Supply Current: 1.16 mA
• Supply Voltage - Max: 5.5 V
• Supply Voltage - Min: 2.7 V

ABSOLUTE MAxIMUM RATINgS
V
OUT_, REF to GND ................................. ....-0.3V to the lower of
CSB, SCLK, LDAC, CLR to GND ............................ -0.3V to +6V
DIN, RDY to GND ........................................-0.3V to the lower of
Continuous Power Dissipation (T
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional opera-
tion of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
PACkAgE THERMAL CHARACTERISTICS (Note 1)
TSSOP
Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer
Note 2: Visit
ELECTRICAL CHARACTERISTICS
(V
values are at T
Maxim Integrated
Output DACs with Internal Reference and SPI Interface
DC PERFORMANCE (Note 4)
Resolution and Monotonicity
Integral Nonlinearity (Note 5)
Differential Nonlinearity (Note 5)
Offset Error (Note 6)
Offset Error Drift
Gain Error (Note 6)
Gain Temperature Coefficient
Zero-Scale Error
Full-Scale Error
DD
Junction-to-Case Thermal Resistance (θ
DD
TSSOP (derate at 10mW/NC above 70NC) ...................797mW
WLP (derate at 16.1mW/NC above 70NC) ..................1288mW
Junction-to-Ambient Thermal Resistance (θ
, V
= 2.7V to 5.5V, V
DDIO
board. For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal-tutorial.
PARAMETER
to GND ................................................ -0.3V to +6V
www.maximintegrated.com/app-notes/index.mvp/id/1891
A
Ultra-Small, Quad-Channel, 8-/10-/12-Bit Buffered
= +25NC.) (Note 3)
DDIO
= 1.8V to 5.5V, V
A
= +70NC)
SYMBOL
(V
DNL
INL
OE
GE
N
(V
DDIO
JC
DD
GND
) ...............30NC/W
JA
+ 0.3V) and +6V
+ 0.3V) and +6V
) .......100NC/W
MAX5713
MAX5714
MAX5715
MAX5713
MAX5714
MAX5715
MAX5713
MAX5714
MAX5715
With respect to V
With respect to V
= 0V, C
MAX5713/MAX5714/MAX5715
L
= 200pF, R
CONDITIONS
REF
REF
Maximum Continuous Current into Any Pin .................... Q50mA
Operating Temperature Range ........................ -40NC to +125NC
Storage Temperature Range ............................ -65NC to +150NC
Lead Temperature (TSSOP only)(soldering, 10s) ...........+300NC
Soldering Temperature (reflow) .................................... +260NC
WLP
L
for information about the thermal performance of WLP packaging.
= 2kI, T
Junction-to-Ambient Thermal Resistance (θ
(Note 2) ........................................................................62NC/W
A
= -40NC to +125NC, unless otherwise noted. Typical
-0.25
-0.25
MIN
-0.5
-0.5
-1.0
-0.5
10
12
-1
-1
-5
8
0
Q0.05
Q0.25
Q0.05
Q0. 5
Q0.1
Q0.2
Q0.5
Q0.1
Q3.0
TYP
Q10
+0.25
+0.25
MAx
+0.5
+0.5
+1.0
+0.5
JA
+1
+1
+5
10
)
ppm of
UNITS
FV/NC
FS/NC
%FS
%FS
LSB
LSB
Bits
mV
mV
2