LPC1112FHN33/202 NXP Semiconductors, LPC1112FHN33/202 Datasheet - Page 70
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LPC1112FHN33/202
Manufacturer Part Number
LPC1112FHN33/202
Description
ARM Microcontrollers - MCU CortexM0 32bit 16KB
Manufacturer
NXP Semiconductors
Datasheet
1.LPC1114FN2810212.pdf
(114 pages)
Specifications of LPC1112FHN33/202
Rohs
yes
Core
ARM Cortex M0
Data Bus Width
32 bit
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NXP Semiconductors
Table 16.
[1]
[2]
LPC111X
Product data sheet
Symbol
I
DD
WDT OSC enabled, V
Low-current mode PWR_LOW_CURRENT selected when running the set_power routine in the power profiles.
I
IRC disabled, System Oscillator disabled, System PLL disabled, BOD disabled.
All peripherals disabled in the SYSAHBCLKCTRL register. Peripheral clocks to UART and SPI0/1 disabled in system configuration
block.
Typical ratings are not guaranteed. The values listed are at room temperature (25 C), nominal supply voltages.
DD
measurements were performed with all pins configured as GPIO outputs driven LOW and pull-up resistors disabled,
Power consumption at very low frequencies using the watchdog oscillator
Parameter
supply current
9.4 Power consumption LPC1100XL series
DD
(LPC111x/103/203/303/323/333)
= 3.3 V, Temp = 25 C.
Conditions
Active mode; code
executed from flash
Sleep mode;
All information provided in this document is subject to legal disclaimers.
system clock = 8.8 kHz
system clock = 257 kHz
system clock = 515 kHz
system clock = 784 kHz
system clock = 1028 kHz
system clock = 2230 kHz
system clock = 8.8 kHz
system clock = 257 kHz
system clock = 515 kHz
system clock = 784 kHz
system clock = 1028 kHz
system clock = 2230 kHz
while(1){}
Rev. 8 — 20 February 2013
[1]
LPC1110/11/12/13/14/15
32-bit ARM Cortex-M0 microcontroller
Min
-
-
-
-
-
-
-
-
-
-
-
-
Typ
275
305
335
368
396
538
274
285
295
309
317
368
[2]
© NXP B.V. 2013. All rights reserved.
-
-
-
-
-
-
-
-
-
-
Max
-
-
70 of 114
Unit
A
A
A
A
A
A
A
A
A
A
A
A