LPC1112FHN33/202 NXP Semiconductors, LPC1112FHN33/202 Datasheet - Page 102
LPC1112FHN33/202
Manufacturer Part Number
LPC1112FHN33/202
Description
ARM Microcontrollers - MCU CortexM0 32bit 16KB
Manufacturer
NXP Semiconductors
Datasheet
1.LPC1114FN2810212.pdf
(114 pages)
Specifications of LPC1112FHN33/202
Rohs
yes
Core
ARM Cortex M0
Data Bus Width
32 bit
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
LPC1112FHN33/202
Manufacturer:
NXP
Quantity:
1 600
Company:
Part Number:
LPC1112FHN33/202
Manufacturer:
NXP
Quantity:
5 000
Part Number:
LPC1112FHN33/202
Manufacturer:
NXP/恩智浦
Quantity:
20 000
NXP Semiconductors
LPC111X
Product data sheet
Fig 59. Reflow soldering of the TSSOP20 package
Footprint information for reflow soldering of TSSOP20 package
DIMENSIONS in mm
0.650
P1
0.750
P2
7.200
Hy
Ay
solder land
occupied area
Gy
C
4.500
By
1.350
C
P2
D2 (4x)
0.400
D1
Refer to the package outline drawing for actual layout
All information provided in this document is subject to legal disclaimers.
0.600
D2
Rev. 8 — 20 February 2013
6.900
Gx
Generic footprint pattern
P1
5.300
Gy
Hx
Gx
7.300
Hx
LPC1110/11/12/13/14/15
7.450
Hy
32-bit ARM Cortex-M0 microcontroller
(0.125)
D1
(0.125)
By
Ay
© NXP B.V. 2013. All rights reserved.
sot360-1_fr
SOT360-1
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