LPC1112FHN33/202 NXP Semiconductors, LPC1112FHN33/202 Datasheet - Page 104

• Manufacturer Part Number: LPC1112FHN33/202
• Description: ARM Microcontrollers - MCU CortexM0 32bit 16KB
• Manufacturer: NXP Semiconductors

Specifications of LPC1112FHN33/202

• Rohs: yes
• Core: ARM Cortex M0
• Data Bus Width: 32 bit

NXP Semiconductors
LPC111X
Product data sheet
Fig 61. Reflow soldering of the HVQFN24 package
Footprint information for reflow soldering of HVQFN24 package
Dimensions in mm
Issue date
0.500
P
5.000
Ax
07-05-07
09-06-15
Hy
5.000
Ay
solder land
solder paste deposit
solder land plus solder paste
occupied area
Gy
(0.105)
3.200
Bx
3.200
By
0.900
C
C
D
Refer to the package outline drawing for actual layout
All information provided in this document is subject to legal disclaimers.
0.240
D
nSPy
Rev. 8 — 20 February 2013
2.500
SLx
Generic footprint pattern
nSPx
2.500
P
SLy
SPx tot
SLx
Hx
Gx
Bx
Ax
SPx tot
1.500
LPC1110/11/12/13/14/15
SPx
SPy tot
SPy
1.500
32-bit ARM Cortex-M0 microcontroller
0.025
0.550
SPx
0.550
SPy
4.300
Gx
0.025
SLy
4.300
Gy
By
© NXP B.V. 2013. All rights reserved.
Ay
5.250
nSPx
Hx
2
sot616-3_fr
SOT616-3
5.250
104 of 114
nSPy
Hy
2