LPC1113FBD48/303,1 NXP Semiconductors, LPC1113FBD48/303,1 Datasheet - Page 95

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LPC1113FBD48/303,1

Manufacturer Part Number
LPC1113FBD48/303,1
Description
ARM Microcontrollers - MCU Cortex-M0 24 kB Fl 8 kB SRAM
Manufacturer
NXP Semiconductors
Datasheet

Specifications of LPC1113FBD48/303,1

Rohs
yes
Core
ARM Cortex M0
Processor Series
LPC1113
Data Bus Width
32 bit
Maximum Clock Frequency
50 MHz
Program Memory Size
24 KB
Data Ram Size
8 KB
On-chip Adc
Yes
Operating Supply Voltage
1.8 V to 3.6 V
Operating Temperature Range
- 65 C to + 150 C
Package / Case
LQFP-48
Mounting Style
SMD/SMT
Factory Pack Quantity
250
NXP Semiconductors
Fig 52. Package outline SOT361-1 (TSSOP28)
LPC111X
Product data sheet
TSSOP28: plastic thin shrink small outline package; 28 leads; body width 4.4 mm
DIMENSIONS (mm are the original dimensions)
Notes
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
2. Plastic interlead protrusions of 0.25 mm maximum per side are not included.
UNIT
mm
OUTLINE
VERSION
SOT361-1
max.
1.1
A
28
1
Z
y
0.15
0.05
A
1
pin 1 index
0.95
0.80
A
2
IEC
0.25
A
3
e
D
0.30
0.19
b
p
MO-153
All information provided in this document is subject to legal disclaimers.
JEDEC
0.2
0.1
c
REFERENCES
D
9.8
9.6
Rev. 8 — 20 February 2013
0
(1)
b
p
E
4.5
4.3
(2)
15
14
w
JEITA
scale
0.65
2.5
M
e
H
6.6
6.2
E
LPC1110/11/12/13/14/15
c
5 mm
A
L
1
2
A
1
0.75
0.50
32-bit ARM Cortex-M0 microcontroller
L
p
0.4
0.3
Q
H
E
E
detail X
PROJECTION
EUROPEAN
0.2
v
L
L
p
0.13
w
Q
A
(A )
0.1
3
© NXP B.V. 2013. All rights reserved.
y
ISSUE DATE
X
θ
99-12-27
03-02-19
v
Z
0.8
0.5
A
M
(1)
SOT361-1
A
8
0
θ
95 of 114
o
o

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