LPC1113FBD48/303,1 NXP Semiconductors, LPC1113FBD48/303,1 Datasheet - Page 103
LPC1113FBD48/303,1
Manufacturer Part Number
LPC1113FBD48/303,1
Description
ARM Microcontrollers - MCU Cortex-M0 24 kB Fl 8 kB SRAM
Manufacturer
NXP Semiconductors
Datasheet
1.LPC1114FN2810212.pdf
(114 pages)
Specifications of LPC1113FBD48/303,1
Rohs
yes
Core
ARM Cortex M0
Processor Series
LPC1113
Data Bus Width
32 bit
Maximum Clock Frequency
50 MHz
Program Memory Size
24 KB
Data Ram Size
8 KB
On-chip Adc
Yes
Operating Supply Voltage
1.8 V to 3.6 V
Operating Temperature Range
- 65 C to + 150 C
Package / Case
LQFP-48
Mounting Style
SMD/SMT
Factory Pack Quantity
250
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NXP Semiconductors
LPC111X
Product data sheet
Fig 60. Reflow soldering of the TSSOP28 package
Footprint information for reflow soldering of TSSOP28 package
DIMENSIONS in mm
0.650
P1
0.750
P2
7.200
Hy
Ay
solder land
occupied area
Gy
C
4.500
By
1.350
C
P2
D2 (4x)
0.400
D1
Refer to the package outline drawing for actual layout
All information provided in this document is subject to legal disclaimers.
0.600
D2
Rev. 8 — 20 February 2013
9.500
Gx
Generic footprint pattern
P1
5.300
Gy
Hx
Gx
11.800
Hx
LPC1110/11/12/13/14/15
7.450
Hy
32-bit ARM Cortex-M0 microcontroller
(0.125)
D1
(0.125)
By
Ay
© NXP B.V. 2013. All rights reserved.
sot361-1_fr
SOT361-1
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