LPC1113FBD48/303,1 NXP Semiconductors, LPC1113FBD48/303,1 Datasheet - Page 106

• Manufacturer Part Number: LPC1113FBD48/303,1
• Description: ARM Microcontrollers - MCU Cortex-M0 24 kB Fl 8 kB SRAM
• Manufacturer: NXP Semiconductors

Specifications of LPC1113FBD48/303,1

• Rohs: yes
• Core: ARM Cortex M0
• Processor Series: LPC1113
• Data Bus Width: 32 bit
• Maximum Clock Frequency: 50 MHz
• Program Memory Size: 24 KB
• Data Ram Size: 8 KB
• On-chip Adc: Yes
• Operating Supply Voltage: 1.8 V to 3.6 V
• Operating Temperature Range: - 65 C to + 150 C
• Package / Case: LQFP-48
• Mounting Style: SMD/SMT
• Factory Pack Quantity: 250

NXP Semiconductors
LPC111X
Product data sheet
Fig 63. Reflow soldering of the HVQFN33 package (7x7)
Footprint information for reflow soldering of HVQFN33 package
solder land
solder paste deposit
occupied area
solder land plus solder paste
solder resist
Dimensions in mm
All information provided in this document is subject to legal disclaimers.
SPD = 1.00 SP
Rev. 8 — 20 February 2013
0.20 SR
chamfer (4×)
PID = 7.25 PA+OA
OwDtot = 5.10 OA
SDhtot = 2.70 SP
OID = 8.20 OA
DHS = 4.85 CU
LbD = 5.80 CU
LaD = 7.95 CU
evia = 4.25
evia = 2.40
4.55 SR
Remark:
Stencil thickness: 0.125 mm
GapD = 0.70 SP
e = 0.65
LPC1110/11/12/13/14/15
32-bit ARM Cortex-M0 microcontroller
W = 0.30 CU
0.45 DM
(A-side fully covered)
number of vias: 20
B-side
© NXP B.V. 2013. All rights reserved.
Solder resist
covered via
0.30 PH
0.60 SR cover
0.60 CU
001aao134
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