LPC1114FHN33/302 NXP Semiconductors, LPC1114FHN33/302 Datasheet - Page 107
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LPC1114FHN33/302
Manufacturer Part Number
LPC1114FHN33/302
Description
ARM Microcontrollers - MCU 32b 32K Flash 42I/O
Manufacturer
NXP Semiconductors
Datasheet
1.LPC1114FN2810212.pdf
(114 pages)
Specifications of LPC1114FHN33/302
Rohs
yes
Core
ARM Cortex M0
Processor Series
LPC1114
Data Bus Width
32 bit
Maximum Clock Frequency
50 MHz
Program Memory Size
32 KB
Data Ram Size
8 KB
Package / Case
HVQFN-33
Mounting Style
SMD/SMT
Interface Type
I2C, SPI, SSP, UART
Maximum Operating Temperature
+ 85 C
Number Of Programmable I/os
42
Number Of Timers
4
Program Memory Type
Flash
Factory Pack Quantity
260
Tradename
LPC1100L
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Part Number:
LPC1114FHN33/302
Manufacturer:
NXP/恩智浦
Quantity:
20 000
Company:
Part Number:
LPC1114FHN33/302:5
Manufacturer:
Intersil
Quantity:
419
Part Number:
LPC1114FHN33/302:5
Manufacturer:
NXP/恩智浦
Quantity:
20 000
NXP Semiconductors
LPC111X
Product data sheet
Fig 64. Reflow soldering of the LQFP48 package
Footprint information for reflow soldering of LQFP48 package
DIMENSIONS in mm
0.500
P1
0.560
P2
10.350
Hy
Ax
solder land
occupied area
Gy
10.350 7.350
Ay
C
Bx
7.350
By
Refer to the package outline drawing for actual layout
All information provided in this document is subject to legal disclaimers.
P2
1.500
C
D2 (8×)
Rev. 8 — 20 February 2013
0.280
Generic footprint pattern
D1
P1
0.500
D2
Hx
Gx
Bx
Ax
7.500
Gx
LPC1110/11/12/13/14/15
7.500 10.650 10.650
(0.125)
Gy
32-bit ARM Cortex-M0 microcontroller
Hx
D1
Hy
By
© NXP B.V. 2013. All rights reserved.
Ay
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